| Allicdata Part #: | ATS-08C-82-C3-R0-ND |
| Manufacturer Part#: |
ATS-08C-82-C3-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08C-82-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.97°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is critical in electronics because it can determine the life span of a component in certain thermal environment. A thermal management solution should dissipate heat away from electronics components to protect those components from damage. ATS-08C-82-C3-R0 is one kind of Thermal – Heat Sinks, which is widely used in soldering, circuit boards, telecommunication sensors and in other areas.
ATS-08C-82-C3-R0\'s structure is featured with small size, light weight, superior thermal dissipation and strong insulation. It is made of anodized aluminum alloy sheet, and adopts precise cutting, bending, welding and sandblasting process, making it heat-sinkable and durable. The thermal pad with thickened structure can effectively reduce thermal resistance. Moreover, it has excellent thermal conductivity, which can ensure the heat transfer efficiency and keep a steady performance in various severe environments.
The working principal of ATS-08C-82-C3-R0 is as following: Firstly, the device will be mounted onto the base of the circuit board, allowing it to sit flush. This will ensure that the thermal pad directly contacts with the surface of the circuit board for effective thermal dissipation. Heat generated from the electronic devices will be conducted through the aluminum alloy sheet into the thermal pad, and dissipates away from the device.
Since its installation does not require any tools or extra components, ATS-08C-82-C3-R0 is relatively easy to install and operate. With its superior heat dissipation, it can provide a highly efficient and reliable thermal management solution for many applications. It can be applied in soldering, circuit boards, telecommunication sensors and many more applications. With its lightweight and portable features, it can be used in any limited space environment. In addition, the robust and corrosion-resistant aluminum alloy materials ensure its high durability and reliability.
In conclusion, ATS-08C-82-C3-R0 is an ideal Thermal – Heat Sink product for thermal management purpose in electronics. It is light weight, compact in size, superior thermal dissipation, and extremely durable with excellent corrosion resistance. It highly reliable and energy efficient and easy to install, making it a popular choice in many applications.
The specific data is subject to PDF, and the above content is for reference