| Allicdata Part #: | ATS-08D-01-C3-R0-ND |
| Manufacturer Part#: |
ATS-08D-01-C3-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-01-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a crucial aspect of most modern electronics and is essential for improving their performance, longevity and reliability. Heat sinks are an important part of the thermal management design. ATS-08D-01-C3-R0 is a specialized type of heat sink that is commonly used in a variety of applications needing efficient and effective heat transfer. In this article, we’ll discuss the specific application field and working principle of ATS-08D-01-C3-R0.
ATS-08D-01-C3-R0 is a cooling device designed to be used with thermal modules and systems. It is a low profile heat sink with a rectangular shape, featuring a unique array of holes on the surface for efficient heat dispersal. The design of the fins allows the heat sink to dissipate heat faster and more evenly compared to other designs. This is especially important when mounting the device onto components with extremely high operating temperatures.
The most common applications of ATS-08D-01-C3-R0 include power transistors, driver circuits, microprocessors, and field effect transistors, but the device is also suitable for other applications. It is commonly used in computer systems, automotive electronics, communications and recording systems, medical equipment, household appliances, and other electronic devices. Its sturdy construction and superior performance make it an optimal choice for a variety of purposes.
ATS-08D-01-C3-R0 works by dispersing heat away from components. This is done by conduction, where the heat transfers from the hot components to the surface of the heat sink where it can be dissipated by air cooling. The device utilizes the principle of convection, which is the natural tendency of hot air to rise away from the heat source. This allows the device to quickly and efficiently disperse the hot air.
In terms of design, the ATS-08D-01-C3-R0 features an aluminium alloy build with integrated heat spreader ribbons and an efficient fin design. These fins provide a large surface area for improved heat dissipation compared to other designs. The heat spreader ribbons further improve the heat transfer rate, ensuring the device operates at the optimal temperature for communication and operation.
Overall, the ATS-08D-01-C3-R0 is an efficient, reliable, and high-performance heat sink device that is suitable for a variety of applications. Its all-aluminium alloy construction ensures sturdy and durable performance in the most extreme conditions. Its unique array of fins and spreader ribbons further increases the surface area for effective heat dissipation. This makes it an optimal choice for applications requiring top-quality thermal performance.
The specific data is subject to PDF, and the above content is for reference