| Allicdata Part #: | ATS-08D-05-C1-R0-ND |
| Manufacturer Part#: |
ATS-08D-05-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-05-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.69°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management has become increasingly important as electronic components become increasingly fine and powerful. ATS-08D-05-C1-R0 is an advanced thermal management solution, which is designed to provide efficient and reliable cooling to electrical components. This device can be used in a variety of applications, including industrial electronics, medical devices, and even entertainment gaming systems.
The ATS-08D-05-C1-R0 is a small, lightweight heat sink that is designed to provide efficient cooling to high-power electronic equipment. It features an advanced heat-dissipating design that enables it to dissipate heat quickly and efficiently without the need for additional cooling fans or external ventilation. The device is also designed to be lightweight and easy to install, making it suitable for a variety of applications.
The ATS-08D-05-C1-R0 plays a critical role in helping ensure a longer, cooler life for electronic components. By dissipating heat away from sensitive components, it helps to reduce cyclic thermal fatigue and maintain an optimal temperature. In addition, its efficient design reduces the amount of power required to maintain the desired temperature, allowing machines to run hotter and faster without the risk of overheating.
The ATS-08D-05-C1-R0 works by using a combination of convection and radiation to move heat away from the heat source. It is designed to be mounted on the surface of the component or board, and it then functions as a thermal bridge between the component and the surrounding air. The hot air is then vented out of the device using a fan or other air flow system, which helps to cool down both the component and the system as a whole.
The ATS-08D-05-C1-R0 is designed to be connected to an integrated circuit or board, providing direct cooling to the source. Its advanced thermal design ensures that heat is dissipated quickly and efficiently, helping to maximize the life of the components. In addition, it is designed to provide an even distribution of cooling to ensure maximum component life, reducing the risk of hot spots and premature component failure.
The ATS-08D-05-C1-R0 is an excellent solution for cooling components in a variety of applications. It is highly efficient, lightweight, and cost-effective, making it a great choice for those looking for reliable, efficient cooling. As it is designed to provide an even distribution of cooling, it is an ideal choice for a wide variety of applications, and it is an excellent choice for those looking for a reliable, efficient thermal management solution.
The specific data is subject to PDF, and the above content is for reference