ATS-08D-10-C1-R0

Thermal heat sinks are specialized purpose-built components attached to electronic devices to absorb heat that is generated by the device. Thermal heat sinks are typically used to cool midsize to large processor and power device chassis.

The ATS-08D-10-C1-R0 thermal heat sink is a specialized heat sink designed to integrate into a wide range of electronic devices. It is suitable for applications in board-level and system-level cooling. It is designed to handle up to 2 watts of power dissipation, and can operate up to 10 degrees Celsius below the ambient temperature of the device it is cooling.

The ATS-08D-10-C1-R0 thermal heat sink offers an efficient design that incorporates two different technologies to ensure optimal cooling. The first technology is a finned base construction, which increases the surface area of the base to increase heat dissipation. The second technology is a fan design, which increases air circulation around the heat sink to maximize cooling.

The ATS-08D-10-C1-R0 thermal heat sink has a peak thermal resistance of 0.629 °C / W , which is suitable for cooling devices that generate up to 2 watts of power. It also has a compact design, with dimensions of 20 x 25 x 10 mm, and a weight of 17 grams, making it suitable for applications in confined spaces.

In terms of installation, the ATS-08D-10-C1-R0 thermal heat sink can be either bolted or glued into place. A variety of thermal pastes, thermal adhesives, and thermal conductive tapes can be used to ensure secure installation and maximum heat dissipation. Furthermore, it also has an integrated retention clip to ensure secure installation.

In terms of cost-effectiveness, the ATS-08D-10-C1-R0 thermal heat sink is an economical choice for cooling electronic devices. It is manufactured using quality materials, and provides excellent thermal performance and reliability.

In conclusion, the ATS-08D-10-C1-R0 thermal heat sink is an excellent choice for cooling a wide range of electronic devices. It has an efficient finned base construction and fan design to increase heat dissipation, and has a thermal resistance of 0.629 °C / W. It is also cost-effective, featuring an integrated retention clip for secure installation, and is suitable for applications in confined spaces.