| Allicdata Part #: | ATS-08D-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-08D-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal-heat sinks are mechanical devices typically used to remove heat from an electronic component or system. They are often employed as part of a cooling system to extend the life of products and improve their performance. The ATS-08D-10-C3-R0 is a thermal-heat sink that has been used in numerous applications.
ATS-08D-10-C3-R0 Application Field and Working Principle
The ATS-08D-10-C3-R0 thermal-heat sink is used in a wide variety of applications. It is commonly employed as part of power supplies, electronic circuit boards, laser printers, and PCs. It is also found in LED lighting systems, communication systems, high-power amplifiers, and medical equipment. It is often used as a component in industrial process control systems, automotive electronics, and industrial automation devices.
The ATS-08D-10-C3-R0 thermal-heat sink has been designed as a passive cooling system. As heat is generated within an electronic device, the thermal-heat sink absorbs it, then dissipates it to the surrounding environment. This thermal regulation process ensures that the temperature inside the device does not exceed the maximum temperature levels which can damage it.The ATS-08D-10-C3-R0 thermal-heat sink consists of three major components – a base plate, heat-conducting fins, and a mounting plate. The base plate is made of aluminum or copper alloy, and it provides a solid, durable foundation for the other two components. Heat-conducting fins are attached to the base plate using a thermal-grade glue, and their purpose is to increase the rate of heat dissipation from the device. The fins are also designed to maximize the amount of surface area exposed to air. Finally, the mounting plate is used to attach the thermal-heat sink to the device, and it can be made of either aluminum or steel.
In conclusion, the ATS-08D-10-C3-R0 thermal-heat sink is a versatile device that is used in a wide range of applications. It utilizes its three main components – a base plate, fins, and a mounting plate – to passively remove heat from an electronic device or system and dissipate it to the surrounding environment. This ensures that the device does not become damaged due to excessive heat. By using this thermal-heat sink, electronic devices can have improved performance and durability.
The specific data is subject to PDF, and the above content is for reference