| Allicdata Part #: | ATS-08D-110-C3-R1-ND |
| Manufacturer Part#: |
ATS-08D-110-C3-R1 |
| Price: | $ 5.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-110-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.73067 |
| 30 +: | $ 4.46796 |
| 50 +: | $ 4.20512 |
| 100 +: | $ 3.94235 |
| 250 +: | $ 3.67953 |
| 500 +: | $ 3.41671 |
| 1000 +: | $ 3.35100 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are an important part of any electronic device that involves heating elements. A thermal heat sink is an electronically engineered device that helps to spread heat away from sensitive components and circuits. Among these thermal heat sinks, the ATS-08D-110-C3-R1 is an affordable and efficient device that delivers consistent performance.
ATS-08D-110-C3-R1 Application Field
The ATS-08D-110-C3-R1 is a great choice for applications that involve sizable heat dissipation. This device is designed for use in electronic devices and components such as CPUs, GPUs, and other power-sensing elements. It is also compatible with LED lighting systems, power amplifiers, automotive components, and industrial automation projects.
ATS-08D-110-C3-R1 Working Principle
The ATS-08D-110-C3-R1 works by spreading heat away from sensitive components and circuits in two effective methods. The first is by using aluminum finned heat sinks, which are designed to act as a thermal bridge between the hot and cold parts of the device. This enables heat to transfer into the fins from the hot parts of the device, which then dissipate the heat evenly into the surrounding environment. The second is through the use of heat conducting materials such as copper or other thermally conductive compounds, which are also used to efficiently transfer heat away from the components. These components then allow the heat to dissipate away from the components and into the surrounding environment.
Conclusion
The ATS-08D-110-C3-R1 is an efficient and cost-effective thermal heat sink that provides excellent heat dissipation from sensitive components and circuits. This device works by using both aluminum finned heat sinks and heat-conducting materials to effectively transfer and dissipate heat away from the components. This thermal heat sink is suitable for applications involving sizable heat dissipation, making it an ideal choice for LED lighting systems, power amplifiers, CPUs, GPUs, automotive components, and industrial automation projects.
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