| Allicdata Part #: | ATS-08D-115-C1-R0-ND |
| Manufacturer Part#: |
ATS-08D-115-C1-R0 |
| Price: | $ 3.23 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-115-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.93643 |
| 30 +: | $ 2.85705 |
| 50 +: | $ 2.69829 |
| 100 +: | $ 2.53953 |
| 250 +: | $ 2.38085 |
| 500 +: | $ 2.30148 |
| 1000 +: | $ 2.06339 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.31°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks is a type of technology that focuses on using heat sinks to transfer heat away from hardware components. Heat sinks are designed to lower temperatures in electronic components by absorbing and dissipating thermal energy. ATS-08D-115-C1-R0 is a type of heat sink that is specifically geared towards high-power semiconductor applications. It is designed to provide an efficient and quiet cooling solution for applications that generate high levels of heat.
ATS-08D-115-C1-R0 is a type of active heat sink that utilizes advanced thermal plane technology to enhance the overall cooling efficiency of electronics applications. This technology uses minimal airflow to effectively transfer heat away from the electronic components. The heat transferred away from the electronic components is then dissipated into the surrounding environment. This allows electronics to remain at an operational temperature and prevents excessive heat build-up.
The main purpose of ATS-08D-115-C1-R0 is to provide a reliable and energy-efficient cooling solution for applications that generate a lot of heat. This heat sink has an extruded aluminum construction which provides excellent heat transfer capabilities and low weight. Additionally, the heat sink is designed with a solid copper base which effectively dissipates heat away from the components. By utilizing this technology, the heat generated by the electronic components is quickly and efficiently dissipated into the surrounding environment.
The ATS-08D-115-C1-R0 is an effective solution for electronics applications that require a reliable and efficient cooling solution. This heat sink is designed to be highly efficient and to reduce power consumption. Additionally, its unique thermal plane construction minimizes power consumption and noise in the application. This makes the ATS-08D-115-C1-R0 the ideal choice for applications that require high levels of cooling efficiency.
The ATS-08D-115-C1-R0 heat sink is the perfect solution for applications that generate a lot of heat. Its efficient thermal plane construction helps to reduce temperatures, while also reducing power consumption and noise. Additionally, the heat sink\'s solid copper base ensures that heat is quickly and efficiently dissipated into the surrounding environment. As a result, the ATS-08D-115-C1-R0 is the ideal choice for electronics applications that require high levels of cooling efficiency.
The specific data is subject to PDF, and the above content is for reference