ATS-08D-117-C1-R0

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Thermal management is an important factor in many electronic applications, such as computing, communication, and automotive. One of the most commonly used thermal solutions for these applications is the heat sink. Heat sinks are devices that help dissipate the heat generated by electrical components, and protect them from becoming overexposed to high temperatures or hot spots. The ATS-08D-117-C1-R0 is a high-performance heat sink specifically designed for thermal management in a wide range of applications.

The ATS-08D-117-C1-R0 is a multi-bracketed, highly efficient, and cost-effective solution for controlling excessive thermal loss. This heat sink includes a slide-in emitter with integrated coefficient of thermal transfer (COT), and its multiple heat sinks provide optimal thermal transfer efficiency. It is available in both anodized aluminum and stainless steel versions, and is suitable for medium-to-high power applications.

The key components of the ATS-08D-117-C1-R0 are its cooling fins, anodized aluminum base, slide-in heatsink and four mounting brackets. The cooling fins, made of anodized aluminum, create increased surface area and efficient heat conduction for quick heat dissipation. The slide-in heatsink, which is nylon reinforced, optimizes thermal performance by providing an excellent thermal transfer coefficient. The anodized aluminum base ensures the maximum heat transfer and acts as a heated surface for dissipating heat away from components. The four mounting brackets allow the heatsink to be easily mounted on a thermal testing platform, allowing for quick and accurate test placement.

The ATS-08D-117-C1-R0 can be used in a variety of applications due to its versatile design. It can be used in electronic components for medical and automotive applications, such as inverters, controllers, and transformers. It is also suitable for other applications such as lighting, industrial manufacturing, HVAC/R, and consumer electronics. The heat sink can also be used with heat pipes and other cooling methods, such as liquid or air cooling, for increased thermal efficiency.

The ATS-08D-117-C1-R0 works on the principle of thermodynamics, in which moving air across a surface increases the cooling rate of the components underneath. As the air moves across the fins, heat is transferred away from the components and dissipated into the surrounding environment. The slide-in heat sink also helps to reduce thermal transfer times, allowing heat to be transferred away from components faster than with traditional heat sinks. Additionally, the mounting brackets provide a secure attachment to a testing platform for accurate test placement.

The ATS-08D-117-C1-R0 heat sink is a reliable and cost-effective solution for managing excessive thermal loss. It is designed to provide optimal cooling performance for a variety of applications, making it a great choice for any thermal management system. The multiple features of the heat sink make it a great choice for cooling both small and large components.

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