| Allicdata Part #: | ATS14367-ND |
| Manufacturer Part#: |
ATS-08D-131-C2-R0 |
| Price: | $ 5.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-131-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.05260 |
| 10 +: | $ 4.91589 |
| 25 +: | $ 4.64285 |
| 50 +: | $ 4.36968 |
| 100 +: | $ 4.09658 |
| 250 +: | $ 3.82347 |
| 500 +: | $ 3.55036 |
| 1000 +: | $ 3.48209 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.60°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of any electronic equipment. If excessive heat accumulates anywhere, it can lead to problems with the system’s performance or even catastrophic failure. The ATS-08D-131-C2-R0 is a thermal device designed to efficiently dissipate heat. Its application field and working principle are discussed in this article.
The ATS-08D-131-C2-R0 is specifically designed as a heat sink for any type of electronic equipment. Generally, it is used in either consumer or industrial settings with electronics of varying sizes. This heat sink is particularly suited for use with high-power components, such as microprocessors or power supplies. These components can generate a large amount of heat, so an effective thermal solution is essential.
The ATS-08D-131-C2-R0 uses a passive two-stage cooling system. First, a fan is used to draw in air and circulate it around the heat sink. This helps keep components cool. Second, heat is dissipated via an array of fins made of aluminum alloy. These fins increase the surface area of the device, allowing it to disperse heat more quickly and efficiently.
The ATS-08D-131-C2-R0 is designed with excellent durability in mind. Not only does the aluminum alloy make it resistant to wear and corrosion, but the device also has a high-temperature rating of up to 400K. This means that it can withstand extended periods of high-temperature operation, which is essential for high-power components.
The ATS-08D-131-C2-R0 is secured in place via two mounting rods. These rods are made of steel so they don’t bend or warp over time. This ensures secure and reliable mounting of the device onto any type of electronics. In addition to its secure mounting, this thermal device also offers excellent flexibility when it comes to positioning. It can be mounted in any orientation, which makes it suitable for use in a wide variety of applications.
In summary, the ATS-08D-131-C2-R0 is a thermal device specifically designed for efficient heat dissipation from high-power components. It uses a passive two-stage cooling system to effectively keep components cool. Its aluminum alloy construction and high-temperature rating make it highly durable and reliable. Finally, its two steel mounting rods provide secure and reliable mounting and excellent flexibility when it comes to positioning.
The specific data is subject to PDF, and the above content is for reference