| Allicdata Part #: | ATS-08D-148-C1-R0-ND |
| Manufacturer Part#: |
ATS-08D-148-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-148-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are important components in the high-technology industry, and the ATS-08D-148-C1-R0 is a leading solution for thermal - heat sink applications. This article will discuss the application field and working principle of this product.
The ATS-08D-148-C1-R0 is widely used in various industrial applications, such as telecommunications, military electronic systems, automotive, and power supply units. It is also widely used in high-performance computing, network storage devices, and gaming systems. The ATS-08D-148-C1-R0 offers excellent thermal performance with superior Durability, Reliability, and low power consumption, making it suitable for applications that require high levels of thermal efficiency.
The ATS-08D-148-C1-R0 is designed with a thermal compound, which acts as a heat conductor between the heatsink and the processor or the heatsink and the board. This thermal compound is able to densely fill in these micro-gaps, allowing the heat to be quickly dissipated from the processor or the board. It also has a high thermal conductivity, which means that it can quickly transfer the heat to the Heatsinks, allowing the heat to be efficiently cooled and dissipated.
In addition, the ATS-08D-148-C1-R0 has a unique design that helps to spread the heat more evenly across the device. This ensures that the device does not become over-heated and can continue to operate at a high level of performance. The ATS-08D-148-C1-R0 also utilizes a combination of materials such as copper, aluminum, and plastic in order to provide superior thermal performance and maximum flexibility in its applications.
The ATS-08D-148-C1-R0 is also designed to be highly resistant to corrosion and can stand up to extreme climates and temperatures. It is also capable of operating in a wide range of temperatures, making it an ideal choice for applications that require high thermal efficiency. In addition, the ATS-08D-148-C1-R0 is designed to be stable and durable for long-term use.
Finally, the ATS-08D-148-C1-R0 is designed to be easy to install. It utilizes a comprehensive system of mounting hardware that is compatible with any type of system, including those with higher performance demands. This makes it easy to install and configure the Thermal - Heat Sink, allowing users to maximize its potential.
In conclusion, the ATS-08D-148-C1-R0 is an impressive solution for thermal - heat sink applications. It is designed with both thermal efficiency and durability in mind, and has the capacity to stand up to extreme temperatures and climates. Furthermore, its installation process is simple and straightforward, making it an ideal choice for a wide range of thermal applications. Thanks to its versatility and performance, the ATS-08D-148-C1-R0 is a top choice for many professionals in the high-technology industry.
The specific data is subject to PDF, and the above content is for reference