ATS-08D-153-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-08D-153-C1-R0-ND

Manufacturer Part#:

ATS-08D-153-C1-R0

Price: $ 3.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08D-153-C1-R0 datasheetATS-08D-153-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.13866
30 +: $ 3.05361
50 +: $ 2.88401
100 +: $ 2.71435
250 +: $ 2.54470
500 +: $ 2.45987
1000 +: $ 2.20541
Stock 1000Can Ship Immediately
$ 3.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.93°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Heat sinks are a critical component in many electrical and electronic components. They absorb, transfer and dissipate heat generated from the components they are attached to. ATS-08D-153-C1-R0 is a popular thermal heat sink used in many applications requiring efficient thermal management.

Function of ATS-08D-153-C1-R0 Thermal Heat Sink

ATS-08D-153-C1-R0 is a low-profile heat sink designed for a wide range of applications including power supplies, DC-DC converters, motor controllers and power transistors. It offers superior heat dissipation in a relatively small package. This heat sink is composed of several thin parallel fins that increase the surface area exposed to the air. The fins are coupled with a baseplate and fitted with a clip to secure it to the component.

Application of ATS-08D-153-C1-R0 Thermal Heat Sink

The ATS-08D-153-C1-R0 is a popular choice for a wide range of electrical and electronic applications. It can be used to cool rubber surfaces, plastic, metal and even wood. It is also used to keep components such as processors, transistors, diodes, DC-DC converters and even circuit boards from overheating. Due to its low-profile design, it can be used in cases where clearance space is limited. It is also highly efficient in dissipating heat and reduces power consumption.

Working Principle of ATS-08D-153-C1-R0 Thermal Heat Sink

The ATS-08D-153-C1-R0 works by conducting the heat away from the component. Heat is generated when components operate, and the fins of the heat sink absorb this heat directly from the components. This heat is dissipated into the surrounding air via natural convection. This process of dissipating heat is called cooling. The clip attached to the heat sink physically secures the heat sink to the component and ensures efficient thermal transfer from component to heat sink.

Conclusion

The ATS-08D-153-C1-R0 is an efficient thermal heat sink that can be used in a variety of applications and offers superior thermal management. Its low-profile design makes it an ideal choice for applications in areas where space is at a premium. It offers efficient heat conductivity and is designed to improve the life of components by keeping them cool.

The specific data is subject to PDF, and the above content is for reference

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