ATS-08D-170-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS14410-ND

Manufacturer Part#:

ATS-08D-170-C2-R0

Price: $ 3.84
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X15MM R-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08D-170-C2-R0 datasheetATS-08D-170-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 3.49020
10 +: $ 3.40011
25 +: $ 3.30800
50 +: $ 3.12430
100 +: $ 2.94052
250 +: $ 2.75675
500 +: $ 2.66487
1000 +: $ 2.38918
Stock 1000Can Ship Immediately
$ 3.84
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 10.07°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are widely used in electronics, often for cooling down and managing the environment of expensive equipment. The ATS-08D-170-C2-R0 Heat Sink is an advanced heat sink, designed for use in demanding industrial applications.

Application Field

The ATS-08D-170-C2-R0 Heat Sink is designed for a wide range of industrial applications, including medical equipment, telecommunications, and industrial machinery. Ideally suited for higher-power applications, this unique heat sink offers superior cooling performance while still maintaining a reasonable cost. It is also well-suited for a variety of alternative applications, like consumer electronics and automotive markets.

The ATS-08D-170-C2-R0 Heat Sink is made of aluminum, which provides an ideal balance of strength and conductivity. This combination of heat sink material and construction leads to a very efficient heat sink with very low thermal resistance. The proprietary fin shape and design of the chassis helps to minimize turbulence and increase the heat dissipation rate, allowing for even higher performance.

Not only does this heat sink offer exceptional performance, but it is also very easy to install. All that is necessary is to attach the sink to the board with screws, nuts and springs. The ease of installation makes the ATS-08D-170-C2-R0 Heat Sink a great choice for professionals who may not have as much experience installing thermal components.

Working Principle

The ATS-08D-170-C2-R0 Heat Sink works by using the same principles as any other heat sink. Heat is generated from the process of thermal activity of the components in the device; the heat sink is used to dissipate this generated heat and keep the system cool. The ATS-08D-170-C2-R0 Heat Sink works by using simple conduction as the heat flow is forced away from the processor and eventually dissipates into the atmosphere.

The ATS-08D-170-C2-R0 Heat Sink is designed to offer maximum efficiency in both cooling performance and cost. The aluminum construction ensures efficient heat dissipation and allows for a larger area on the heat sink. This wider area enables larger amounts of heat to be dissipated, allowing for superior cooling performance. The proprietary fin design used in the ATS-08D-170-C2-R0 Heat Sink helps to reduce turbulence and helps to cool down the processor even further.

Conclusion

The ATS-08D-170-C2-R0 Heat Sink is an excellent choice for a variety of industrial and consumer applications. This heat sink offers superior cooling performance and is easy to install, making it perfect for those with limited installation experience. Its aluminum construction ensures efficient heat dissipation and its unique fin design reduces turbulence and ensures optimal cooling. The ATS-08D-170-C2-R0 Heat Sink is the perfect choice for those who are looking for a reliable and cost-effective heat sink solution.

The specific data is subject to PDF, and the above content is for reference

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