ATS-08D-170-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.26°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction:

Thermal - Heat Sinks are one of the most important components used in the industries today. They are highly effective, efficient and reliable thermal management solutions. ATS-08D-170-C3-R0 is an outstanding example of the Thermal - Heat Sinks type. This article will provide a comprehensive overview of the application field and working principle of ATS-08D-170-C3-R0.

Application Field:

ATS-08D-170-C3-R0 thermal-heat sink is a highly effective and efficient thermal management solution that is widely used in a variety of applications. The most common application fields include automotive industries, aerospace industries, consumer electronics, medical industries, and military and hybrid applications.In automotive industries, ATS-08D-170-C3-R0 thermal-heat sink is used to dissipate the heat generated by the engines and other components in the automotive system. This helps to maintain the desired operating temperature for optimized performance.In aerospace industries, ATS-08D-170-C3-R0 thermal-heat sink is used to protect delicate electronic components from extreme temperatures. This ensures that the electronic components can operate properly and maintain optimized performance.In consumer electronics, ATS-08D-170-C3-R0 thermal-heat sink is used to keep electronics such as laptops, computers, and other gadgets cool so that they can perform at an optimum level.In medical industries, ATS-08D-170-C3-R0 thermal-heat sink is used to dissipate heat created by medical devices. This ensures that medical devices are adequately cooled to ensure optimal performance and patient safety.In military and hybrid applications, ATS-08D-170-C3-R0 thermal-heat sink is used to dissipate the heat generated by multiple electronic components in the system. This helps to protect sensitive components from heat damage and attain optimal performance.

Working Principle:

ATS-08D-170-C3-R0 thermal-heat sink works on the principle of thermal convection. Thermal convection is a process in which heat is transferred from a warmer surface to a colder surface through air movement. This air movement is generated due to the difference in temperature between the two surfaces.In ATS-08D-170-C3-R0 thermal-heat sink, the heat from the electronic components is transferred to the fins of the heat sink, which then dissipates the heat to the surrounding air through the process of thermal convection. The air movement due to the differences in temperature helps to cool the electronic components and helps to maintain a certain operating temperature in the system.

Conclusion:

ATS-08D-170-C3-R0 is a highly efficient and reliable thermal-heat sink technology. It is widely used in a variety of application fields due to its highly effective and efficient thermal management solution. ATS-08D-170-C3-R0 works on the principle of thermal convection and helps to maintain an optimum operating temperature for the electronic components in the system.

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