| Allicdata Part #: | ATS-08D-178-C3-R0-ND |
| Manufacturer Part#: |
ATS-08D-178-C3-R0 |
| Price: | $ 3.94 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-178-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.58596 |
| 30 +: | $ 3.38646 |
| 50 +: | $ 3.18730 |
| 100 +: | $ 2.98809 |
| 250 +: | $ 2.78888 |
| 500 +: | $ 2.58968 |
| 1000 +: | $ 2.53987 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are important components used in a variety of industries to dissipate heat in electronic components. The ATS-08D-178-C3-R0 is a specific type of heat sink designed for high power and thermal efficiency. It is composed of extruded aluminum alloy and has an overall thermal resistance of 0.1°C/W. The ATS-08D-178-C3-R0 has a maximum working temperature of 150°C, making it suitable for use with many types of devices, including those in extreme environments.
The ATS-08D-178-C3-R0 has two distinct design features which increase the amount of heat that can be moved away from the unit. Firstly, it has dual-extruded fins that allow for more efficient air flow. This ensures that air passes effortlessly around the unit and that more heat energy is absorbed by the fins. Secondly, the ATS-08D-178-C3-R0 is constructed with a raised base. This ensures that the base forms a tight bond with the device it is attached to.
The working principle of the ATS-08D-178-C3-R0 is based on the idea of thermodynamics. Heat flows from an area of higher temperature to one of lower temperature. This is known as heat conduction. Heat sinks employ the principles of conduction and convection to dissipate heat. Heat conduction occurs when heat is transferred from one object to another through direct contact. The fins of a heat sink act as a bridge between the device being cooled and the surrounding air, allowing the heat to be dissipated quickly and efficiently.
Convection is another important principle utilized by heat sinks. Convection occurs when air or other gases move around the fins of the heat sink. The fins create a barrier between the device and the air, forcing the hot air to travel further and dissipate faster. This increases the overall effectiveness of the heat sink.
The ATS-08D-178-C3-R0 is designed to be used in a variety of applications. It is suitable for use with microprocessors, power transistors, voltage drivers, relay coils, electromechanical devices, and switching components. The ATS-08D-178-C3-R0 also offers efficient cooling for high-powered lamps and LED lighting systems. In addition, its high thermal efficiency makes it suitable for use in laser systems and high-powered electronics.
The ATS-08D-178-C3-R0 is a reliable and efficient thermal-heat sink that offers superior heat dissipation for a variety of applications. Its dual-extruded fins and raised base ensure efficient heat conduction and convection, while its peak temperature of 150°C makes it suitable for even the most extreme environments. Heat sinks are important components in many industries and the ATS-08D-178-C3-R0 provides an effective solution for efficient cooling.
The specific data is subject to PDF, and the above content is for reference