| Allicdata Part #: | ATS-08D-18-C3-R0-ND |
| Manufacturer Part#: |
ATS-08D-18-C3-R0 |
| Price: | $ 4.33 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-18-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.89781 |
| 30 +: | $ 3.68151 |
| 50 +: | $ 3.46487 |
| 100 +: | $ 3.24834 |
| 250 +: | $ 3.03178 |
| 500 +: | $ 2.81523 |
| 1000 +: | $ 2.76109 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-08D-18-C3-R0 is a type of thermal device, namely a heat sink. A heat sink is a device that mounts to and removes heat from an electronic component, usually a semiconductor. This allows a processor or other device to remain at an acceptable operating temperature, avoiding overheating. The ATS-08D-18-C3-R0 is a specific type of thermal heat sink, designed for large power semiconductor applications.
A thermal heat sink consists of a body or base plate, which provides the mechanical and thermal mounting interface to the device being cooled. This base plate contains a series of fins formed of aluminium, copper, or anodized aluminium. These fins are designed to draw heat away from the electronic component and dissipate it into the surrounding environment, generally by using natural or forced convection. To further increase the effectiveness of the heat exchange process, the fins are designed to have air spaces between them, which allows air to move through them more easily.
The ATS-08D-18-C3-R0 thermal heat sink is designed to dissipate large power electronic components that require a high degree of cooling efficiency. The heat sink also features an increased surface area due to the larger size of the fins. This increased surface area results in better heat dissipation and allows the heat sink to be used with applications that require higher power dissipation.
In addition to providing thermal performance, the ATS-08D-18-C3-R0 also has excellent mechanical stability, making it suitable for a wide range of large power semiconductor applications. The base plate is highly polished for good contact with the semiconductor, and the fins are anodized for corrosion protection. The ATS-08D-18-C3-R0 also provides a large thermal range, with a temperature range of up to 200°C.
The ATS-08D-18-C3-R0 thermal heat sink is an excellent choice for a range of applications. It is perfect for applications such as high-powered LED lighting, automotive electronics, power grids, and HVAC systems. The ATS-08D-18-C3-R0 provides excellent heat dissipation and mechanical stability for these types of applications. It is also easy to install and requires no additional mounting hardware.
The specific data is subject to PDF, and the above content is for reference