| Allicdata Part #: | ATS14423-ND |
| Manufacturer Part#: |
ATS-08D-182-C2-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-182-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.84930 |
| 10 +: | $ 3.74787 |
| 25 +: | $ 3.53934 |
| 50 +: | $ 3.33119 |
| 100 +: | $ 3.12304 |
| 250 +: | $ 2.91483 |
| 500 +: | $ 2.70663 |
| 1000 +: | $ 2.65458 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-08D-182-C2-R0 thermal-heat sink is a popular type of heat sink that is widely used in the industry. It is designed to efficiently transfer heat generated in electronic components into the ambient air or surrounding coolant. It features a finned baseplate and integral fan cover with louvers that allow for maximum air flow and cooling. The design is also engineered to minimize noise and vibration. The ATS-08D-182-C2-R0 is a highly reliable and cost-effective heat dissipation solution suitable for many applications.
Introduction
A thermal-heat sink is a device used to dissipate heat generated by electronic components during operation. It is typically composed of a metal casing and fins with the fins ensuring maximum air flow over the components for effective heat transfer. Heat sinks are widely used in numerous applications, including telecommunications, computer systems, consumer electronics, automotive, and aerospace. As the demand for more powerful and efficient components increases, properly-designed and well-engineered heat sinks are essential for ensuring optimal performance and reliability.
ATS-08D-182-C2-R0 Design Features
The ATS-08D-182-C2-R0 thermal-heat sink has a finned baseplate and integral fan cover with louvers to improve air flow and cooling. The baseplate is made from 4mm aluminum with a six-fin, die-cast design that ensures maximum air flow and efficient cooling. It is designed to be mounted to a standard, full-sized ATX motherboard.
The fan cover is designed with louvers in the top and bottom to maximize air flow. These louvers are designed to allow for noise and vibration reduction while ensuring a high level of air flow, and work in conjunction with the finned baseplate and fan to effectively dissipate the heat. In addition, an optional heatsink fan (not included) can be added for enhanced cooling.
Benefits of ATS-08D-182-C2-R0
The ATS-08D-182-C2-R0 thermal-heat sink provides numerous benefits to users. It is designed to be a highly reliable and cost-effective cooling solution for many applications. Its finned baseplate and integral fan cover with louvers allow for maximum air flow and cooling, along with reduced noise and vibration. The all-metal construction ensures a durable and long-lasting heat sink solution. In addition, the ATS-08D-182-C2-R0 is compatible with many popular brands of ATX motherboards, which makes it easier to integrate into any existing system.
ATS-08D-182-C2-R0 Application Field and Working Principle
The ATS-08D-182-C2-R0 thermal-heat sink is designed to be used in a variety of applications. It is most commonly used to dissipate heat generated in electronics during operation. Its finned baseplate and fan cover ensure maximum air flow and efficient cooling, which can be further enhanced with an additional heatsink fan (not included). The all-metal construction of the heat sink ensures durability and long-term reliability.
The basic working principle of the heat sink is to transfer heat away from the component, either by convection or radiation. Heat transfer is best achieved when there is an increased air flow over the surface of the component, which is ensured by the ATS-08D-182-C2-R0. The finned baseplate and louvered fan cover ensure maximum air flow to effectively cool the component, which helps to avoid overheating and potential component damage or failure.
Conclusion
The ATS-08D-182-C2-R0 thermal-heat sink is a highly-reliable and cost-effective cooling solution that is suitable for many applications. Its finned baseplate and integral fan cover with louvers allow for maximum air flow and cooling, along with reduced noise and vibration. It is designed to be mounted to popular full-sized ATX motherboards and is an essential component for ensuring optimal performance and reliability of electronic components during operation. The ATS-08D-182-C2-R0 thermal-heat sink is a great choice for anyone looking for a dependable and efficient cooling solution.
The specific data is subject to PDF, and the above content is for reference