ATS-08D-184-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-08D-184-C3-R0-ND

Manufacturer Part#:

ATS-08D-184-C3-R0

Price: $ 4.24
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08D-184-C3-R0 datasheetATS-08D-184-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.81717
30 +: $ 3.60507
50 +: $ 3.39293
100 +: $ 3.18087
250 +: $ 2.96881
500 +: $ 2.75675
1000 +: $ 2.70374
Stock 1000Can Ship Immediately
$ 4.24
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.24°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

The ATS-08D-184-C3-R0 is a thermal-heat sink designed for the purpose of dissipating heat away from sensitive components and ensuring they remain cool and operational. It utilizes convection and advanced materials to efficiently and safely draw heat away from targeted components, guaranteeing they remain within their specified temperature range.

Applications

The ATS-08D-184-C3-R0 is ideal for a wide variety of applications. These include:

  • PCs
  • Servers and telecom equipment
  • LED lighting systems
  • Military and aviation systems
  • Industrial controllers
  • Surveillance and security systems
  • Medical and laboratory devices

Construction and Materials

The ATS-08D-184-C3-R0 is made of a combination of materials designed to maximize cooling efficiency. The primary construction includes a lightweight aluminum base with a soldered alloy grid pattern within it. Additionally, an aluminum extrusion is inserted between the fins of the grid for added strength. The fins are coated with a proprietary graphite finish to ensure minimal thermal resistance.

Working Principle

The ATS-08D-184-C3-R0 operates on the principle of heat conduction. The device uses an aluminum base and patent-pending zinc alloy to absorb and dissipate heat from the device or component to which it is attached via the supplied mounting hardware. This material was chosen due to its high conductivity, low weight, and good corrosion resistance, making it well-suited for the demands of thermally-challenging applications.

The aluminum fins below the surface draw hot air away from the target device or component using convection, increasing the surface\'s effective area and rate of heat flow. The fins are arranged in two layers, with an extruded aluminum column in between them to increased the surface area and evenly distribute the heat. The graphite coating on the fins reduces thermal resistance, making the heat sink more effective.

Benefits

In addition to its high-efficiency design and construction, the ATS-08D-184-C3-R0 provides several additional benefits when compared to traditional heatsinks. These include:

  • Long life: The ATS-08D-184-C3-R0 is made from premium materials that are designed to last for years under normal operating conditions.
  • Compact size: The ATS-08D-184-C3-R0 is extremely compact for its cooling capacity, making it ideal for tight spaces.
  • Lightweight: The ATS-08D-184-C3-R0 is significantly lighter than many traditional heatsinks, making it easier to install and transport.
  • High performance: The ATS-08D-184-C3-R0 is designed to draw heat away from the target device or component at an accelerated rate, ensuring optimal performance.
  • Cost-effective: The ATS-08D-184-C3-R0 is more cost-effective than many traditional heatsinks due to its advanced design and efficient construction.

Conclusion

The ATS-08D-184-C3-R0 is an advanced thermal-heat sink that is designed to efficiently and safely dissipate heat away from sensitive components and ensure they remain at optimal temperatures. It is ideal for PCs, servers and telecom equipment, lighting systems, military and aviation systems, industrial controllers, surveillance and security systems, and medical and laboratory devices. It utilizes an advanced design and construction, featuring a lightweight aluminum base, soldered alloy grid pattern, extruded aluminum column, and graphite-coated fins to reduce thermal resistance, resulting in an effective and cost-efficient solution to heat dissipation.

The specific data is subject to PDF, and the above content is for reference

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