ATS-08D-204-C1-R0

Thermal management plays a critical role in ensuring proper operating conditions for electronics systems and components, particularly as higher performance and denser packaging become more prevalent. Heat sinks are the most common type of cooling component for electronics applications. The ATS-08D-204-C1-R0 heat sink is a finned heat sink designed to optimizeforced convection cooling for medium power electronic components in compact systems.

Material Selection

The ATS-08D-204-C1-R0 heat sink is made of aluminum to ensure it has a high thermal conductivity and light weight. This combination of properties makes aluminum ideal for heat sinks in electronic cooling applications. Aluminum is also a cost effective material that can be used in applications where weight is a major factor. Aluminum heat sinks are well suited for use in environments with wide temperature ranges.

Structural Design

The ATS-08D-204-C1-R0 heat sink is designed with a finned structures. The design is made with extruded aluminum and heat sink fins, which act as a large surface area for heat transfer. The flat aluminum base is designed for optimal thermal contact, and the embedded fins can be customized for the particular application environment. In this way, specific cooling requirements can be addressed.

Mounting System

The ATS-08D-204-C1-R0 heat sink utilizes a universal mounting system to ensure its compatibility with a wide variety of electronic components. It utilizes a set of four holes to mount it securely onto a circuit board with four screws. The mounting system also ensures the heat sink is firmly in place and tight against the board, which will maximize the transfer of heat.

Heat Transfer Mechanism

The ATS-08D-204-C1-R0 heat sink features a finned design that optimizes the airflow and enables Forced Convection, which is the most efficient way to cool powered components. This is done by forcing air to pass through the fins, dissipating the heat from the heat sink to the cooler ambient surrounding. The Forced Convection cooling is effective in removing the heat to maintain a steady state temperature for the operating system.

Application

The ATS-08D-204-C1-R0 heat sink is designed for medium power electronic components in compact systems. It can be used to cool high wattage components such as microprocessor integrated circuits, DIMM memory modules, and other heat-generating components that require active cooling. This heat sink is well-suited for high-end computer system applications where high-speed and low power consumption are desired.

Conclusion

The ATS-08D-204-C1-R0 heat sink is a finned heat sink designed to maximize forced convection cooling for medium power electronic components in compact systems. Its unique design enables effective heat transfer, and its universal mounting system allows it to be used with a variety of electronic components. As such, it is an ideal solution for applications requiring efficient thermal management.