| Allicdata Part #: | ATS-08D-210-C1-R0-ND |
| Manufacturer Part#: |
ATS-08D-210-C1-R0 |
| Price: | $ 5.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-210-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.78863 |
| 30 +: | $ 4.52256 |
| 50 +: | $ 4.25653 |
| 100 +: | $ 3.99055 |
| 250 +: | $ 3.72451 |
| 500 +: | $ 3.45848 |
| 1000 +: | $ 3.39196 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.17°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
Heat sinks are essential components of any electronics cooling system, and are most effective when used in combination with fans and other cooling techniques. The ATS-08D-210-C1-R0 is a highly efficient heat sink designed to improve the performance of thermal management solutions. In this article, we will explore the application field and working principle of the ATS-08D-210-C1-R0.
Application Field
The ATS-08D-210-C1-R0 is ideal for applications requiring low-noise cooling solutions. It is suitable for use in a wide range of markets including system cooling, medical, industrial electronics, and telecommunications. This heat sink is especially well suited for applications that require extended operating temperatures, such as medical imaging and telecom equipment.
Working Principle
The ATS-08D-210-C1-R0 utilizes a passive cooling design, relying on the natural principles of conduction to draw heat away from the component. This heat sink is constructed from high-grade aluminum alloy and features a flat profile with multiple fins to maximize the surface area available for heat dissipation. The surface of the heat sink is treated with a non-reflective black coating to further improve thermal performance.
The ATS-08D-210-C1-R0 features two mounting points, allowing it to be securely and easily attached to any standard motherboard or other thermal management system. This heat sink has an airflow pressure of 230mm H2O, enabling it to move large amounts of air past the components, further increasing its cooling rate. Combined with a fan or other cooling solutions, the ATS-08D-210-C1-R0 can provide efficient cooling for a wide range of electronics.
Conclusion
The ATS-08D-210-C1-R0 is a highly efficient heat sink designed for applications requiring low-noise cooling solutions. Its efficient design enables it to efficiently transfer heat from a component, while its mounting points make it easy to attach to almost any thermal management system. Combined with a fan or other cooling system, the ATS-08D-210-C1-R0 is a great choice for cooling a wide range of applications.
The specific data is subject to PDF, and the above content is for reference