ATS-08D-32-C1-R0

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Heat sinks are widely used in electrical and mechanical applications to dissipate heat generated by electronic components and machinery. Generally, heat sinks are pieces of metal, such as aluminum or copper, that are configured to allow the exchange of thermal energy between the heat source and the surrounding environment. Heat sinks are commonly used with power electronics and microprocessors, but they also can find use in heat exchangers, or other needs.

One type of heat sink is the ATS-08D-32-C1-R0, which finds application in a range of applications. This particular heat sink is primarily designed for use in thermal management of electrical and electronic components, such as components in server and storage systems, telecommunication equipment, and other applications that require superior thermal performance.

The ATS-08D-32-C1-R0 is a fan-less, two-stage heat sink that provides cooling with low power consumption. The main body is made of extruded aluminum that has been designed with ribbing for improved airflow. There is also a mounting plate included for attaching the heat sink to the device being cooled. The heat sink is designed to be compatible with various processor packages, including the Intel socket 775 and LGA667.

The main function of the ATS-08D-32-C1-R0 is to transfer heat away from components to the environment in order to reduce their operating temperature. This is accomplished through its two-stage cooling design, which utilizes conduction to transfer heat away from the device and into the air. In the first stage, heat is transferred from the device through the mounting plate and into the fins of the heat sink. The fin-to-air contact surface area is maximized, allowing heat to be quickly transferred away from the heat source. The air then moves through the fins, resulting in thermal conduction.

The fins of the heat sink also contain vents that accelerate convective cooling, which allows even more heat to be dissipated. This two-stage approach results in better thermal performance than most single-stage designs. The fins of the ATS-08D-32-C1-R0 also feature ridges, which make them better at dissipating heat and thus increasing efficiency.

The ATS-08D-32-C1-R0 has an efficiency rating of 95%. It also features a noise level of 22 dB(A), which is low enough to be suitable for a wide variety of applications. Additionally, the heat sink is designed to be mounted in any orientation, making it an ideal choice for challenging thermal management problems. The device is also RoHS compliant, which means it is a safe and reliable solution for industrial applications.

The ATS-08D-32-C1-R0 is a great solution for those looking for an efficient, yet cost-effective way to cool electronic components. The two-stage cooling design ensures superior thermal performance, while the included mounting plate and RoHS compliance make the heat sink easy to install and safe to use. Due to its broad application field and optimal thermal performance, the ATS-08D-32-C1-R0 is a great choice for anyone looking for a reliable and efficient way to cool their electronic components.

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