ATS-08D-32-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-08D-32-C3-R0-ND

Manufacturer Part#:

ATS-08D-32-C3-R0

Price: $ 5.66
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 57.9X36.83X11.43MM T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08D-32-C3-R0 datasheetATS-08D-32-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.08914
30 +: $ 4.80669
50 +: $ 4.52390
100 +: $ 4.24116
250 +: $ 3.95842
500 +: $ 3.67567
1000 +: $ 3.60499
Stock 1000Can Ship Immediately
$ 5.66
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 2.280" (57.90mm)
Width: 1.450" (36.83mm)
Diameter: --
Height Off Base (Height of Fin): 0.450" (11.43mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 21.54°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are important components in various electronic systems and devices. By preservers and transferring potentially damaging thermal energy away from critical components, they help increase the lifespan of electronic devices. For example, the ATS-08D-32-C3-R0 thermal - heat sink is an example of a heat sink specifically designed for the hot environments found in many industrial operations. It is essential for industrial applications to be able to move thermal energy away from sensitive and expensive electronic components.

The ATS-08D-32-C3-R0 thermal - heat sink is designed to move thermal energy away from electronic components by using a process called heat conduction. Heat conduction is the process in which thermal energy, specifically heat, is transferred through physical contact. It allows thermal energy to move from area with higher temperatures to areas with lower temperatures. In the ATS-08D-32-C3-R0, heat is transferred from the hotter component to the cooler area outside, thereby preventing the hotter component from melting or otherwise being damaged by the heat.

The ATS-08D-32-C3-R0 thermal - heat sink features an amazing design that serves to maximize energy transfer away from the warmer object. Unlike other heat sinks on the market, this device features an h-block or fin construct. This design gives it a larger heat transfer area, allowing it to efficiently and quickly cool down components using a minimal amount of energy. The h-block construct also makes for superior thermal performance, meaning that the device can be built for maximum effectiveness in any given situation.

The ATS-08D-32-C3-R0 thermal - heat sink also includes a wide range of features that make it ideal for industrial applications. It is clad in an aluminum casing that is both strong and lightweight. Additionally, it has an improved thermal compound that is designed to supplement the heat transfer process, thus ensuring maximum thermal performance. Moreover, the unit has a low profile base with a 16-pin hole for easy connectivity. This allows it to be easily and quickly connected to different components, simplifying the process of cooling or otherwise moving thermal energy away from electronic objects.

The ATS-08D-32-C3-R0 thermal - heat sink is an ideal choice for a wide range of industrial applications. Its state-of-the-art engineering and design make it one of the most effective solutions for controlling and dissipating potentially damaging thermal energy away from sensitive electronic components. With its strong aluminum casing, improved thermal compound, low profile base, and massive heat transfer area, the ATS-08D-32-C3-R0 is sure to provide amazing thermal performance wherever it is installed.

The specific data is subject to PDF, and the above content is for reference

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