ATS-08D-37-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS-08D-37-C2-R0-ND

Manufacturer Part#:

ATS-08D-37-C2-R0

Price: $ 5.99
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 36.83X57.6X17.78MM T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08D-37-C2-R0 datasheetATS-08D-37-C2-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 5.39028
30 +: $ 5.09061
50 +: $ 4.79128
100 +: $ 4.49177
250 +: $ 4.19232
500 +: $ 3.89287
1000 +: $ 3.81801
Stock 1000Can Ship Immediately
$ 5.99
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Width: 2.267" (57.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.700" (17.78mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.12°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are components used in electronics, designed to improve the cooling of sensitive components such as integrated circuits and transistors. ATS-08D-37-C2-R0 is a type of thermal heat sink manufactured by ATS Corporation. It is used to help cool components that require a high amount of power and are under a strict adherence to temperature requirements. By providing the necessary cooling capabilities, the ATS-08D-37-C2-R0 helps ensure that electronic components remain functioning properly and without overheating or failure.The ATS-08D-37-C2-R0 is a large, finned aluminum heat sink that is designed to be mounted externally to an electronic device or a circuit board. It is typically connected to heat-generating components such as integrated circuits, transistors, and resistors through a thermal paste or thermal pad. The heat sink utilizes the principles of thermal convection and radiation to dissipate the heat from the components to its outer surface.The ATS-08D-37-C2-R0 is composed of several parts: a baseplate, fins, and mounting hardware. The aluminum baseplate serves as the foundation on which the fins and heat sinks are mounted. The fins are comprised of thin, finned aluminum that is contoured to increase surface area and better dissipate the heat away from the component. The mounting hardware is used to secure the ATS-08D-37-C2-R0 to the circuit board or electronic device.The ATS-08D-37-C2-R0 thermal heat sink is built to handle temperatures ranging from -40°C to +60°C. It is also designed to be highly efficient, capable of efficiently dissipating up to 48W of heat. This extra capacity is helpful when dealing with components that generate a lot of heat, or when working with multiple components that require considerable cooling. The ATS-08D-37-C2-R0 is a versatile component that can be used in a variety of applications. It works well as a passive cooling solution for components operating at temperatures around 65°C, or as an active cooling solution when temperatures exceed that range. It is also suitable for providing cooling for small loads, such as transistors or ICs.When looking for a reliable and efficient thermal heat sink for your electronic device, the ATS-08D-37-C2-R0 offers a great option. With its wide temperature range and high thermal capacity, it is suitable for a variety of applications. Its efficient and reliable cooling capabilities help ensure that your components remain in optimal working condition.

The specific data is subject to PDF, and the above content is for reference

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