ATS-08D-42-C1-R0

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Thermal management solutions are an important factor in product reliability and performance. The ATS-08D-42-C1-R0 is a type of thermal-heat sink, which provides effective and efficient cooling to assist in the reduction of temperature-induced stress on electronic components. By understanding its application field, working principle, and features, users can decide if it is suitable for their applications.

Application Field

The ATS-08D-42-C1-R0 is suitable for use in a wide range of applications. The sink design makes it suitable for cooling components of various sizes, including those used in telecommunications, consumer electronics, power supplies, as well as military and aerospace applications. The thermal- heat sink is especially suitable for medium- and high-power electronics components, in particular, FETs, IGBTs, and power MOSFETs.

Working Principle

The ATS-08D-42-C1-R0 features a lightweight, low-cost, and flexible thermal-heat sink design. The design allows it to be easily mounted on a wide variety of circuit board and chassis sizes, as well as provides excellent heat dissipation to keep the components running cooler. The design consists of an array of fins that are spaced apart to leave open air passages. The heat generated by the components is dissipated through these fins and is carried away from the components by convection of the surrounding air.

In addition to the standard air-cooled design, the ATS-08D-42-C1-R0 is also available with a forced-cooling option. This option is integrated into the system and enables the components to remain stable at higher operating temperatures and conditions. By coupling the cooling fins with a blower or fan, the required airflow is increased, allowing the components to remain cooler and maintain optimal performance.

Features

The ATS-08D-42-C1-R0 features a high strength aluminum alloy construction that provides excellent thermal performance. The aluminum alloy features high thermal conductivity and effective heat dissipation that increases the life span of the components and eliminates the need for active cooling. In addition, the thermal-heat sink features a simple design, which allows for easy installation and maintenance. Furthermore, its lightweight design permits efficient cooling of high-power components with minimal space requirements.

The ATS-08D-42-C1-R0 also features various options, such as mounting and fan selection, to meet the needs of specific applications. Various mounting options, such as PCB holes, fasteners, thermal adhesive pads, clips, or tape, are available. The fan selection includes multiple models with a wide range of airflow, noise level, and power consumption. These features and options make the ATS-08D-42-C1-R0 ideal for most cooling applications.

In conclusion, the ATS-08D-42-C1-R0 is a type of thermal-heat sink with excellent thermal performance and low cost. Its lightweight and flexible design, combined with its multiple features and options, make it suitable for a wide range of applications. With its high strength aluminum alloy construction and effective heat dissipation capabilities, the ATS-08D-42-C1-R0 is an effective way to keep electronics cooler and improve product reliability and performance.

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