| Allicdata Part #: | ATS-08D-55-C1-R0-ND |
| Manufacturer Part#: |
ATS-08D-55-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-55-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 23.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are essential components used in numerous applications, ranging from power converters to microprocessors, to help dissipate heat. ATS-08D-55-C1-R0 is a type of heat sink specifically designed to be versatile and highly efficient in dissipating heat from a wide variety of applications. This article will provide an in-depth look at the application field and working principle of ATS-08D-55-C1-R0.
One of the major benefits of ATS-08D-55-C1-R0 is its flexibility, allowing it to be used in a variety of applications. It can be used to dissipate heat from power electronics, such as DC-DC converters and AC-DC converters, as well as from integrated circuits, including CPU and microcontrollers. In addition, it is also suitable for applications where high thermal dissipation is required, such as LED lighting, electric vehicle (EV) power systems, and power supply equipment.
The working principle of ATS-08D-55-C1-R0 involves the use of convection, recombination, and fin configuration to achieve a high rate of heat dissipation. It utilizes a copper-based alloy material that is highly thermally conductive, which allows it to quickly and effectively distribute heat away from high power devices. The fin design of the heat sink also helps to maximize the area exposed to the air, allowing the heat to be dissipated more quickly and efficiently.
In addition to the fin design, ATS-08D-55-C1-R0 also includes a die-stacked design wherein several fins are stacked on top of one another. This helps to increase the surface area for heat dissipation, which increases the heat transfer rate. Furthermore, the heat sink’s metal base also helps to provide a uniform heat dissipation across the entire surface area.
ATS-08D-55-C1-R0 is a highly effective and efficient heat sink, which is why it is commonly used in a variety of applications. Not only does it provide high thermal dissipation, but it also is highly cost-effective, making it a great option for those looking for a customizable, budget-friendly option. Furthermore, its small size and lightweight design make it easy to integrate into different applications and devices.
In summary, ATS-08D-55-C1-R0 is a type of thermal and heat sink that is designed to be highly efficient and versatile in dissipating heat from a wide variety of applications. Its metal alloy base and die-stacked fin design make it highly efficient in heat transfer, while its small size and lightweight design make it easy to integrate into many applications. As such, it is a great option for those looking for a customizable, budget-friendly heat dissipating solution.
The specific data is subject to PDF, and the above content is for reference