| Allicdata Part #: | ATS-08D-63-C3-R0-ND |
| Manufacturer Part#: |
ATS-08D-63-C3-R0 |
| Price: | $ 4.16 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-63-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.78252 |
| 30 +: | $ 3.57231 |
| 50 +: | $ 3.36206 |
| 100 +: | $ 3.15195 |
| 250 +: | $ 2.94182 |
| 500 +: | $ 2.73169 |
| 1000 +: | $ 2.67917 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.42°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks are components designed to shed excess heat from integrated circuits (ICs). They have become increasingly important with the miniaturization of electronics and the consequent rise in power dissipation. As ICs become more powerful, their power-handling capacity is affected by the enclosures and components used in heatsink applications. The ATS-08D-63-C3-R0 is one such example of a thermal-heat sink, and this article outlines its application field and working principle.
Application Field
The ATS-08D-63-C3-R0 thermal-heat sink is designed for use in a wide variety of applications. It is suitable for use in high-temperature environments and can provide effective cooling for ICs up to 63W. The ATS-08D-63-C3-R0 is also designed to be used in multi-chip module applications, where multiple ICs are placed in thermal contact with each other. This makes it an excellent choice for designing high power density applications, as it can quickly and efficiently remove heat from multiple ICs.
Working Principle
The ATS-08D-63-C3-R0 thermal-heat sink employs a passive, surface mount design in which the ICs are actively cooled by a principle known as conduction heat transfer. This heat transfer is achieved by the thermal-heat sink itself acting as a conduit for the thermal energy between the ICs and the ambient air. The thermal-heat sink works by drawing cold air in from outside the enclosure, quickly absorbing the thermal energy from the ICs, and releasing the energy into the surrounding environment. In order for this to occur, the thermal-heat sink must be constructed from a material with a high thermal conductivity, such as aluminum or copper.
The ATS-08D-63-C3-R0 thermal-heat sink is designed to take advantage of forced convection cooling. In this type of setup, air is actively moved with the help of fans to increase the efficiency of heat dissipation. By using a thermally conductive material, the thermal-heat sink can quickly and efficiently absorb the heat from the ICs and release it into the surrounding environment. This reduces the required cooling time of the ICs and increases their reliability.
Conclusion
The ATS-08D-63-C3-R0 thermal-heat sink is a highly effective and efficient tool for cooling ICs in high temperature environments. Its design takes advantage of conduction heat transfer and forced convection cooling, allowing it to quickly and efficiently absorb and dissipate excess thermal energy. As a result, it is an ideal choice for designing high power density applications.
The specific data is subject to PDF, and the above content is for reference