| Allicdata Part #: | ATS-08D-70-C3-R0-ND |
| Manufacturer Part#: |
ATS-08D-70-C3-R0 |
| Price: | $ 4.69 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-70-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.22163 |
| 30 +: | $ 3.98727 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.79°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Heat Sinks - ATS-08D-70-C3-R0 application field and working principle
Heat sinks are one of the most popular and widely used thermoelectric cooling and heating devices. They are used in a variety of applications, such as industrial electronics, consumer electronics, and aerospace and defense. Heat sinks absorb heat from a variety of sources, including heat generated by electronic components, in order to regulate their effective temperature. Heat sinks also provide improved thermal stability to electronic components.
The ATS-08D-70-C3-R0 is one of the most popular and widely used heat sinks available. It features a compact, lightweight design and is suitable for a variety of applications. This heat sink offers efficient thermal performance and helps to reduce the overall power consumption of a device. It is also designed for high thermal resistance and durability. This heat sink is capable of supporting up to 500W of heat, and is ideal for use in applications involving high-power/high-heat systems.
The ATS-08D-70-C3-R0 also features an optimized radiative and convective aluminum heat-sink design which allows for efficient heat transfer between the device and the environment. This heat sink is designed to maintain thermal stability in high temperatures and can reduce the risk of overheating in applications where heat dissipation is required. In addition, its low-profile design allows for minimal interference with components and provides superior air circulation.
The working principle of the ATS-08D-70-C3-R0 is based on a convective heat transfer system. This system operates by using internal airflow and thermal radiation to transfer heat from the device to the environment. The internal airflow increases the overall rate of heat transfer by creating turbulence within the heat sink and allowing for more efficient radiation from within the heat sink. The thermal radiation component allows for heat transfer from the surface of the device to the air around it. This process is then enhanced by the conduction properties of the materials used in the heat sink.
The ATS-08D-70-C3-R0 is designed for use in applications that require efficient heat dissipation. This heat sink is commonly used in high-power/high-heat systems, such as industrial electronics. Additionally, it is often used in consumer electronics, such as laptops and desktop computers. This heat sink is also popular in avionics and aerospace applications. In summary, the ATS-08D-70-C3-R0 heat sink is suitable for a range of applications where efficient thermal stability and performance is required.
The specific data is subject to PDF, and the above content is for reference