| Allicdata Part #: | ATS-08D-72-C1-R0-ND |
| Manufacturer Part#: |
ATS-08D-72-C1-R0 |
| Price: | $ 4.43 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X35MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-72-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.99042 |
| 30 +: | $ 3.76887 |
| 50 +: | $ 3.54715 |
| 100 +: | $ 3.32545 |
| 250 +: | $ 3.10376 |
| 500 +: | $ 2.88206 |
| 1000 +: | $ 2.82664 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.09°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are used to dissipate and reduce the impact of generated heat in various electronic devices. The ATS-08D-72-C1-R0 is a type of thermal heat sink designed to efficiently transfer heat from one medium to another in order to optimize efficiency and ensure good performance.
The ATS-08D-72-C1-R0 is primarily used in consumer electronics, such as smartphones, tablets, and laptops. It can also be used in industrial applications such as computers, medical imaging systems, and laser equipment. It is designed for maximum air flow and maximum contact with the cooling device, which allows it to effectively dissipate heat. It also features multiple fins that allow heat to spread rapidly and uniformly throughout the assembly.
The ATS-08D-72-C1-R0 works in two stages. During the first stage, heat is transferred from the source to the cooling medium, like air or a liquid. During the second stage, the heat is then spread out in an even manner across the fins. The fins transfer heat to the air or liquid in the surrounding environment. This ensures that the device does not get too hot and cause any damage to the components it is protecting.
The ATS-08D-72-C1-R0 is constructed with a combination of materials like aluminum, stainless steel, or copper. Each material brings its own unique characteristics to the assembly. Aluminum is a lightweight and cost-efficient material that is often used to create heat exchangers and cooling systems. On the other hand, stainless steel is more durable and is generally used in applications that need a larger heat-dispersion surface. Copper is the most thermally conductive heat-sink material and is used in more high-performance applications.
This thermal heat sink boasts several features such as a fanless design, superior performance, and a low-noise operation, making it popular for applications that require silent cooling solutions. Its lightweight design also allows it to be easily installed on any type of cooling device. In addition, it can be easily interchanged with other thermal heat sinks, making it a versatile and cost-effective solution for cooling various electronic components.
The ATS-08D-72-C1-R0 is designed to be used in large-scale and industrial applications. It is used for thermal management in a wide variety of applications such as computers, medical imaging systems, server rooms, and laser equipment. Its superior heat transfer capabilities ensure that electronic components in these applications remain cool and operational even at peak operating temperatures.
The ATS-08D-72-C1-R0 is a superior thermal heat sink option for applications in need of a reliable cooling system. Its large surface area and multiple fins efficiently transfer heat away from the source, ensuring stable and reliable performance in high-use electronic applications. With its high thermal conductivity, low noise operation, variety of installation options, and reasonable cost, the ATS-08D-72-C1-R0 is an ideal thermal heat sink for use in a wide variety of systems.
The specific data is subject to PDF, and the above content is for reference