| Allicdata Part #: | ATS-08D-80-C1-R0-ND |
| Manufacturer Part#: |
ATS-08D-80-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-80-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-08D-80-C1-R0 is one of the many thermal - heat sinks that are used in various applications. Heat sinks are used in order to dissipate heat generated by electronic components, preventing them from overheating, which can cause permanent damage. Heat sinks can be made of various materials, including aluminum, copper, and other exotic metal alloys, with the ATS-08D-80-C1-R0 model being made of a combination of aluminum and copper. Heat sinks are designed to take advantage of various physical phenomena in order to increase their effectiveness in dissipating heat.
The most common type of heat sink utilizes the principle of convection to disperse heat. This is performed by having a flow of air around the heat sink, which carries away the heat transferred to the air molecules and disperses it into the environment. This is enhanced by aluminum’s high thermal conductivity and thin profile. Additionally, convection can be enhanced by fins or other structures that increase the surface area of the heat sink and provide more paths for air to travel.
Air-cooled heat sinks typically use fans or blowers to increase the air flow over the heat sink’s fins. The ATS-08D-80-C1-R0 model utilizes a BLDC-type fanless cooling solution, which allows for an even distribution of airflow and volume-driven cooling. Additionally, this model features an optimized conduction path from the base to the fins, as well as advanced thermal engineering that allows for maximum heat dissipation. As a result, the ATS-08D-80-C1-R0 is highly efficient in dissipating heat from the electronic components it is paired with.
Another type of heat sink is liquid-cooled, which is typically found in high-powered components. Liquid-cooled heat sinks take advantage of the greater thermal conductivity of water or another liquid in order to more effectively and rapidly dissipate heat from the electronic component. The ATS-08D-80-C1-R0 is air-cooled and does not utilize liquid-cooling, however it does feature an advanced thermal engineering design that allows for greater heat transfer and efficiency.
The ATS-08D-80-C1-R0 is used in a wide variety of applications, especially in the industrial and automotive sectors due to its high performance and efficiency. Due to its robust design and advanced thermal engineering, the ATS-08D-80-C1-R0 is able to dissipate large amounts of heat quickly and effectively, making it an ideal choice for applications where a reliable and efficient cooling solution is needed.
The specific data is subject to PDF, and the above content is for reference