| Allicdata Part #: | ATS14520-ND |
| Manufacturer Part#: |
ATS-08D-99-C2-R0 |
| Price: | $ 4.85 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X20MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08D-99-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.36590 |
| 10 +: | $ 4.24494 |
| 25 +: | $ 4.00907 |
| 50 +: | $ 3.77332 |
| 100 +: | $ 3.53751 |
| 250 +: | $ 3.30168 |
| 500 +: | $ 3.06585 |
| 1000 +: | $ 3.00689 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.51°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are a critical component used in electronics cooling. They provide a means of dissipating excess heat generated by the electronic components. A Thermal-Heat Sink, such as the ATS-08D-99-C2-R0, is designed specifically to remove and dissipate thermal energy from electronic components.
The ATS-08D-99-C2-R0 is designed to transfer heat from the electronic component to a nearby ambient environment. It has a simple design, allowing it to be used in a variety of applications. The device is composed of a body, fins, and fasteners. Heat is transferred to the fins primarily via conduction, convection, and radiation. As heat is transferred to the fins, it is dissipated quickly into the surrounding air.
The ATS-08D-99-C2-R0 is typically mounted directly to the surface of the electronic component with fasteners, commonly screws, bolts, or adhesive. This direct mounting places the heat sink in contact with the source of the heat. The thermal resistance of the material between the component and heat sink then determines how much heat is transferred from the component to the heat sink. The shape of the fins is designed to maximize the amount of surface area exposed to the ambient environment in order to facilitate the transfer of heat.
The ATS-08D-99-C2-R0 can be used in a wide range of applications, such as in computers, medical equipment, power supplies, LED lighting, and more. The device is lightweight and has an extremely low profile, making it ideal for use in compact, high-heat applications. It has excellent thermal management capabilities, allowing it to transfer large amounts of heat quickly and efficiently while maintaining optimal acoustic performance.
In conclusion, the ATS-08D-99-C2-R0 Thermal-Heat Sink is a high-performance device designed to efficiently dissipate heat from electronic components and provide reliable and cost-effective cooling. The device has an extremely low profile, making it ideal for use in compact environments, and its excellent thermal management capabilities ensure that it can transfer large amounts of heat quickly and efficiently. The ATS-08D-99-C2-R0 is suitable for a wide range of applications, from computers and medical equipment to power supplies and LED lighting.
The specific data is subject to PDF, and the above content is for reference