| Allicdata Part #: | ATS-08E-01-C3-R0-ND |
| Manufacturer Part#: |
ATS-08E-01-C3-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08E-01-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.05°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-08E-01-C3-R0 is a type of thermal-heat sink designed to dissipate the heat generated by high-powered devices. Heat sinks are devices that are used to dissipate heat from a device. The ATS-08E-01-C3-R0 is a type of heat sink specifically designed for applications in higher power electronic devices.
The ATS-08E-01-C3-R0 thermal-heat sink is a copper-alloy-based device that is made from 160 pieces of copper-alloy-based components. Each component is precision machined to exact specifications. The copper-alloy based components are then assembled and soldered together with silver solder. The components are difficult to solder but yields high thermal conductivity.
The thermal-heat sink has a working principle of a combination of convection, thermal radiation, and heat conduction. Heat is transferred away from the heat source by passing the heat through the high-thermal-conductivity components and then transferring it away via convection. This system of dissipating heat from electronics allows for more efficient and effective thermal transfer.
The ATS-08E-01-C3-R0 thermal-heat sink is ideal for applications such as power electronics, medical imaging devices, industrial lasers, LED lighting, and many other thermal management applications. The high-performance thermal-heat sink has superior thermal performance coupled with a simple and compact design that make it suitable for applications where space is at a premium.
The ATS-08E-01-C3-R0 thermal-heat sink has the unique ability to maintain its performance even when exposed to adverse operating environments, such as those with high humidity and dust or dirt. This makes it ideal for use in harsh operating environments, such as those found in medical imaging equipment, industrial lasers, and LED lighting.
The ATS-08E-01-C3-R0 thermal-heat sink is designed with an advanced heat fin system that gives it increased performance and reliability. The fin system is made from aluminum and is designed to increase the surface area that is available for the heat to dissipate, resulting in improved cooling efficiency.
The ATS-08E-01-C3-R0 thermal-heat sink is designed to be extremely easy to install and maintain, requiring only minimal setup and maintenance. The sink comes with mounting hardware and easy-to-follow instructions that make installation and proper maintenance a breeze.
Overall, the ATS-08E-01-C3-R0 thermal-heat sink is an ideal heat dissipating solution for high-powered electronic devices. It is specifically designed for applications in higher power electronic devices, as it features a combination of convection, thermal radiation, and heat conduction to efficiently dissipate heat from the device. It is also designed to be easy to install and maintain, and is capable of withstanding harsh operating environments.
The specific data is subject to PDF, and the above content is for reference