| Allicdata Part #: | ATS-08E-02-C1-R0-ND |
| Manufacturer Part#: |
ATS-08E-02-C1-R0 |
| Price: | $ 3.20 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X12.7MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08E-02-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.91249 |
| 30 +: | $ 2.83395 |
| 50 +: | $ 2.67649 |
| 100 +: | $ 2.51899 |
| 250 +: | $ 2.36157 |
| 500 +: | $ 2.28284 |
| 1000 +: | $ 2.04668 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-08E-02-C1-R0 Thermal - Heat Sink is a passive component that absorbs and dissipates heat generated in electronic components. It is also referred to as a Heat Sink, or Heat Spreader, and is a conductive device used to improve the thermal performance of a heat-generating electronic component, such as an integrated circuit. Heat Sinks are typically installed upon the circuit board, dissipating excess heat through fins, similar to a radiator in a car, allowing the component to perform optimally.
The ATS-08E-02-C1-R0 Thermal - Heat Sink is a compact and light-weight option that is ideal for low-power applications in space-limited environments. The basic construction consists of vertical fins with multiple surfaces for heat dissipation and a flat, base pressure plate. The ATS-08E-02-C1-R0 Thermal - Heat Sink features a unique vertical fin design that provides maximum heat dissipation efficiency, with the thermal resistance around 0.68°C/W at a single point. The base plate and fins are designed to provide good heat transfer performance. With good thermal efficiency and superior surface quality, this heat sink is ideal for applications such as low-power IC, motor control systems, LED lighting, and RF transistor cooling.
The ATS-08E-02-C1-R0 has a single-point mounting design, with an adhesive solution already applied that ensures easy and reliable assembly. The mounting surface of the heat sink is flat, designed to reduce the mounting space and keep the thermal efficiency at an optimal level. The ATS-08E-02-C1-R0 is available with a variety of thermal interfaces such as silicone thermal grease, thermal paste, and thermal tape, and these provide excellent performance with a small footprint. The Thermal - Heat Sink also features a dust cover over the fins, which prevents dust and dirt build-up, and keeps the fin surfaces clean.
The ATS-08E-02-C1-R0 Thermal - Heat Sink is designed for applications requiring a low-profile, light weight thermal solution. With its unique design, it offers a highly efficient heat dissipation surface and is suitable for applications that require a high-efficiency thermal solution, such as LED Lighting, ICs, and RF Transistors. The excellent performance characteristics, along with high durability make this thermal solution one of the best available on the market.
The specific data is subject to PDF, and the above content is for reference