ATS-08E-10-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-08E-10-C1-R0-ND

Manufacturer Part#:

ATS-08E-10-C1-R0

Price: $ 3.61
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08E-10-C1-R0 datasheetATS-08E-10-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.28104
30 +: $ 3.19242
50 +: $ 3.01505
100 +: $ 2.83771
250 +: $ 2.66036
500 +: $ 2.57169
1000 +: $ 2.30565
Stock 1000Can Ship Immediately
$ 3.61
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.87°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-08E-10-C1-R0 Thermal - Heat Sinks

Thermal - Heat Sinks serve as the most effective way of heat dissipation for electrical and electronic components due to its mass, high thermal conductivity, and relatively low manufacturing costs. The ATS-08E-10-C1-R0 is a machined metal-finned heat sink designed to provide optimal cooling performance for a variety of devices.

Application Field and Working Principle

The ATS-08E-10-C1-R0 is designed for a variety of applications, such as LED lighting, power supplies, power transistors, microcontrollers, and other devices with similar power ratings. It is specially designed for applications that require significant current and heat transfer, such as power transistors. It also provides efficient cooling for high-power and high-density applications such as switching power supplies. The main working principle behind its operation is passive heat exchange. Heat is generated by the electronic components to be cooled, which then travels to the heat sink’s thermal fins. The fins dissipate the heat by convection-faster in air than in a solid material, which makes them the ideal choice for cooling.

The ATS-08E-10-C1-R0 is made from aluminum and features a 10-fin heatsink with a high quantity of surface area per cubic inch. This helps dissipate heat quickly over a large area, reducing the temperature of devices or components located close to the fins. Its height is 8mm and has a base diameter of 28.6mm. The recommended thermal resistance for this heat sink is 0.71K/W. This heat sink is also silkscreened for easy installation.

Installation Procedures

When installing the ATS-08E-10-C1-R0 heat sink, first, you must apply a suitable heat-transfer compound to the top side of the heat-transfer component. Next, install the heat swap into the component and secure it in place. Then insert the heat sink atop the thermal component. Finally, cautiously tighten all of the screws on the heat sink- fin spacing and the surface should be sufficient for satisfactory air flow across the top of the heat-transfer component.

Benefits and Drawbacks

The ATS-08E-10-C1-R0 is a great thermal management solution for applications that require significant heat exchange over a large area. Its high quality materials and construction guarantee long-term durability and reliable performance. This heat sink is also very lightweight and easy to install, which makes it an ideal choice for applications where space and weight are an issue. The only downside of this product is that it is not suitable for high-heat applications due to its relatively low watt rating.

Conclusion

The ATS-08E-10-C1-R0 Thermal - Heat Sink is an excellent choice for applications requiring high heat exchange over a large area in a lightweight and easy-to-install package. It is made from high-grade aluminum and features a 10-fin heatsink with a high quantity of surface area for maximum efficiency. Though it is not suitable for high-heat applications due to its relatively low watt rating, it is a great option for low- to medium-power applications.

The specific data is subject to PDF, and the above content is for reference

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