ATS-08E-100-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.79°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal - Heat Sinks ATS-08E-100-C3-R0

Thermal-heat sinks are devices used in many different applications to help regulate or dissipate heat flow. The ATS-08E-100-C3-R0 is an all aluminum extruded heat sink that has been designed specifically for cooling highly sensitive components, such as those used in consumer electronics. It features an optimized finned arrangement to provide maximum cooling efficiency.

Applications of the ATS-08E-100-C3-R0

The ATS-08E-100-C3-R0 can be used for a wide variety of applications, including dissipating CPU core heat in notebook computers, cooling down amps or circuit boards, preventing motherboards from overheating, and protecting expensive components in electronic equipment. It can also be used for cooling LED panels, LED lighting, and other devices that generate heat.

Working Principle of the ATS-08E-100-C3-R0

The working principle of the ATS-08E-100-C3-R0 is based on the natural law of thermodynamics, which states that heat naturally flows from a warmer to a cooler region. In this case, the heat from the controlled component is dissipated into the ambient environment, thus providing a stable thermal environment. The ATS-08E-100-C3-R0 takes advantage of this principle by utilizing an array of fins. These fins enable the heat generated by the controlled component to be evenly distributed across the surface of the extruded aluminum heat sink. In addition to the finned arrangement, the ATS-08E-100-C3-R0 also utilizes thermal transfer compounds to maximize heat transfer. These compounds ensure that heat is spread evenly across the entire surface of the heat sink. Thermal transfer compounds are also used to prevent heat from being trapped within the component, thus optimizing cooling performance.

Conclusion

The ATS-08E-100-C3-R0 is a highly reliable and efficient heat sink designed specifically for cooling highly sensitive components, such as those used in consumer electronics. With its optimized finned and thermal transfer compound design, it provides maximum cooling performance and guarantees stable thermal environment. With its versatility and great value, the ATS-08E-100-C3-R0 is an excellent choice for anyone looking to prevent their electronic components from overheating.

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