| Allicdata Part #: | ATS-08E-110-C3-R1-ND |
| Manufacturer Part#: |
ATS-08E-110-C3-R1 |
| Price: | $ 5.26 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08E-110-C3-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.73067 |
| 30 +: | $ 4.46796 |
| 50 +: | $ 4.20512 |
| 100 +: | $ 3.94235 |
| 250 +: | $ 3.67953 |
| 500 +: | $ 3.41671 |
| 1000 +: | $ 3.35100 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.08°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks provide an effective way of dissipating heat created by electrical and electronic components and assemblies. The ATS-08E-110-C3-R1 is an example of a heat sink designed with two purposes in mind: to minimize temperature rise by transferring heat away from high-density electrical components, and to minimize size and corresponding weight.
Design Features and Functionality
The ATS-08E-110-C3-R1 is an aluminum, aluminium oxide-filled heat sink. It has pre-drilled holes for bolting to the board or enclosure. The shape is designed to generate optimal airflow for effective cooling, and it has a slotted face that allows air circulation.
The ATS-08E-110-C3-R1 can be used for both air- and conduction-based cooling solutions. Its main function is to maximize surface area to better dissipate heat from the component or device to the surrounding air. Because of its high thermal conductivity, aluminum is a great choice for this purpose.
Application Fields
The ATS-08E-110-C3-R1 is used in a variety of applications. It is most commonly found in power electronics, LED lighting, avionics, and automotive applications. It can also be used in communications equipment, industrial machinery, and medical devices. Its compact size and light weight make it a great choice for applications where space is limited or weight needs to be minimized.
Working Principle
The ATS-08E-110-C3-R1 works by transferring heat generated by the electrical device or component to the surrounding air. Heat is dissipated from the component to the aluminum heat sink, which then absorbs the thermal energy and dissipates it into the surrounding air. As air passes over the heat sink, the air is heated, decreasing the temperature of the component, and allowing it to operate correctly.
The ATS-08E-110-C3-R1 is an efficient and cost-effective way to dissipate heat and improve the longevity of electronic components and devices. Its lightweight design and pre-drilled holes make it easy to install in any application.
The specific data is subject to PDF, and the above content is for reference