ATS-08E-116-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.14°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to ATS-08E-116-C2-R0 Thermal - Heat Sinks

heat sinks refer to an engineered apparatus that is designed to dissipate excess heat from microelectronics and electrical components. The ATS-08E-116-C2-R0 Thermal-Heat Sink is a device designed for the purpose of removing heat generated from electronic components to maintain their optimal temperature levels. This device is the ideal solution for providing the necessary cooling power needed for sensitive equipment and components that are prone to overheating.

Application Field

Heat sinks are often used in high-powered electronic equipment and components, such as power electronics, RF systems, CPUs, GPUs, computers, and cell phones. Heat sinks are also used for higher-powered computers, such as servers, to keep them functioning at their peak performance levels.ATS-08E-116-C2-R0 Thermal-Heat Sink is designed for applications where extra cooling power and thermal conductivity is required. Thisheat sink can be used for various purposes, including cooling off embedded systems, thermoelectric ICs, LEDs, high-power transistors, and any components generating a large amounts of heat.

Working Principle

AT-S08E-116-C2-R0 Thermal-Heat Sinks works on the principle of convection-cooling, which is a process in which heat generated from a device is transferred to the surrounding environment. The heat generated from the components is then carried away from the heat source by the air in the surroundings on which the heat sink is placed. This cooling process occurs when there is a difference in temperature between the heat source and the surrounding environment. As a result, the temperature of the device is regulated and maintained at an optimal level.The ATS-08E-116-C2-R0 Thermal-Heat Sink has an advanced thermal transfer plate and an enhanced heatsink base that enable high efficiency cooling. The heat sink plate is equipped with multiple fins that increases the surface area for better air circulation and heat dissipation. Additionally, the heatsink base is made of aluminum, which is an excellent thermal conductor that allows effective thermal transfer to the surrounding air.The ATS-08E-116-C2-R0 Thermal-Heat Sink is also equipped with mounting holes and mounting clips, allowing for easy installation on a variety of motherboards, without requiring any additional tools or hardware. This heat sink also features an adjustable fan speed control, so users can adjust the speed of the fan according to their desired level of cooling.

Conclusion

The ATS-08E-116-C2-R0 Thermal-Heat Sink is an advanced cooling solution designed to provide efficient cooling to sensitive and high-powered electronic components. This heat sink is equipped with an optimized heatsink base and plate for improved cooling and is also effective at dissipating heat generated from embedded systems, thermoelectric ICs, LEDs, and other components. Additionally, the ATS-08E-116-C2-R0 Thermal-Heat Sink comes with user-friendly mounting clips, adjustable fan speed control, and improved thermal transfer capabilities. This ensures that it can provide more efficient and reliable cooling of sensitive electronic components.

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