Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	4.26°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Heat sinks are devices that transfer heat away from an object and disperse it into the environment. They are typically made up of one or more metal plates, often with fins or other structures to increase the surface area. The most commonly used materials for heat sinks are copper and aluminum, although other materials such as stainless steel, nickel, and titanium can also be used.The ATS-08E-116-C3-R0 is a heat sink specifically designed for the thermal management of high-power electronics. It serves two primary purposes: to dissipate heat from a device that is generating too much heat, and to protect a system from overheating due to inadequate ventilation or inefficient cooling.The ATS-08E-116-C3-R0 is composed of a low-thermal-resistance aluminum finned heatsink and a round plate made of reinforced glass epoxy (FR-4). The aluminum fins are spaced approximately 1 mm apart, resulting in a large surface area for cooling. The round plate has a center hole for mounting the heat sink, and its surface level is slightly lower than the fins to reduce air turbulence and improve cooling efficiency. The overall design of the ATS-08E-116-C3-R0 is optimized to ensure that the heatsink remains as efficient as possible for maximum thermal performance.The ATS-08E-116-C3-R0 is designed to provide superior cooling capabilities for a wide variety of applications, such as power conversion equipment in IT, power management, and portable electronics. The device can be used in applications ranging from telecommunications based systems to industrial controllers.The working principle of the ATS-08E-116-C3-R0 is to dissipate heat generated by a device or system to the surrounding environment by convection. The round plate and the aluminum fins create a large surface area for optimal air convection to ensure maximum heat dissipation. The fins are also designed to reduce air turbulence, which increases cooling efficiency. The glass epoxy material used in the round plate also helps to reduce air turbulence and improve cooling efficiency.The ATS-08E-116-C3-R0 is an efficient way to maintain or reduce the operating temperatures of electronics and devices. The device is easy to install and recommended for electronics that require high-power cooling solutions. The high thermal conductivity and low thermal resistance of the aluminum fins ensure maximum heat dissipation, making the ATS-08E-116-C3-R0 an ideal heat sink solution for high-temperature electronics.

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