ATS-08E-156-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-08E-156-C1-R0-ND

Manufacturer Part#:

ATS-08E-156-C1-R0

Price: $ 3.75
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08E-156-C1-R0 datasheetATS-08E-156-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.41208
30 +: $ 3.31968
50 +: $ 3.13526
100 +: $ 2.95079
250 +: $ 2.76641
500 +: $ 2.67419
1000 +: $ 2.39754
Stock 1000Can Ship Immediately
$ 3.75
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.11°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Introduction

ATS-08E-156-C1-R0 is a thermal heat sink designed for maximum heat transfer at high thermal resistance. This thermal heat sink consists of two main components: the base, which is typically made of copper or aluminum and is designed to dissipate heat, and a set of finned structures which are used to extract heat from the base. It also features a fan-less design that relies on natural convection to expel heat quickly without the necessity to be equipped with a fan.

Applications

Thermal heat sinks like the ATS-08E-156-C1-R0 are ideal for applications that require heat transfer at high thermal resistance. Some of the most common applications for this type of heat sink include power amplifiers, lasers, LED lighting, AC motors, and medical imaging systems. By dissipating heat quickly and efficiently, the ATS-08E-156-C1-R0 can help protect sensitive components from the damaging effects of overheating.

Working Principle

The ATS-08E-156-C1-R0 uses a fan-less design to effectively transfer heat away from the unit. This unit features a large base which acts as a heat spreader and is typically made of copper or aluminum for maximum thermal conductivity. Heat is drawn away from the base and transferred to a set of finned structures which act as a radiator to expel the heat into the surrounding environment. To maximize the heat transfer efficiency, the fins are shaped in such a way that air is directed around the finned structures, allowing for maximum heat exchange.

In addition to its fan-less design, the ATS-08E-156-C1-R0 also has some unique features which help it perform efficiently. For instance, it utilizes a hollow design which is designed to draw in cooler ambient air and direct the airflow over the fins to improve heat transfer. Additionally, the unit features slots at the top and bottom, allowing for air to flow both ways and provide maximum heat dissipation and cooling.

Conclusion

The ATS-08E-156-C1-R0 is a highly efficient thermal heat sink designed for applications that require heat transfer at high thermal resistance. It combines a fan-less design with a highly conductive base and finned structures which allow for maximum heat exchange and heat dissipation. This makes the ATS-08E-156-C1-R0 an ideal solution for power amplifiers, lasers, LED lighting, AC motors, and medical imaging systems.

The specific data is subject to PDF, and the above content is for reference

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