| Allicdata Part #: | ATS-08E-157-C3-R0-ND |
| Manufacturer Part#: |
ATS-08E-157-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08E-157-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is all about achieving long-term, reliable performance in electronics, computers and other heat generating devices. One of the most important tools for thermal management is the use of heat sinks. Heat sinks are copper, aluminum or other materials that are designed to absorb and dissipate heat, which is generated from various electronic devices.
ATS-08E-157-C3-R0 is an example of a heat sink specifically designed for thermal management. This heat sink has a wide range of applications. It is made of a high nickel-plated model of aluminum material and features an impressive thermal conductivity of up to 16 Watts/03K. The heat sinks are ideal for use in high-temperature applications.
The working principle of ATS-08E-157-C3-R0 is based on its structure. This heat sink has a series of fins with large surface areas. The fins are designed to dissipate the heat generated from the device. These heat sinks are designed to work in high-temperature conditions, as they can withstand temperatures up to 200 degrees Celsius. As the heat sink absorbs heat from the device, it dissipates it to the surrounding environment.
ATS-08E-157-C3-R0 is an ideal choice for high-temperature applications. It is highly effective in controlling temperature fluctuations and improving the durability and overall performance of the device. The heat sink is also great for dissipating heat from microprocessors and other small electronic components.
In addition to its impressive thermal conductivity, ATS-08E-157-C3-R0 heat sink is also designed to be compatible with a variety of components. It is designed to fit standard component sizes and it can be attached to the bottom or top of a heat source. This helps to maximize the efficiency of the system and ensure effective heat dissipation.
The ATS-08E-157-C3-R0 is designed for optimal performance. It is lightweight and easy to install and use. The heat sink also offers excellent reliability, with its high-quality material and construction. The heat sink is designed to last for many years with minimal maintenance.
Overall, ATS-08E-157-C3-R0 is a great choice for thermal management. It offers excellent performance and durability. The heat sink is easy to install and use and it is designed to fit standard component sizes. With its superior thermal conductivity, the ATS-08E-157-C3-R0 is ideal for high-temperature applications.
The specific data is subject to PDF, and the above content is for reference