| Allicdata Part #: | ATS-08E-169-C3-R0-ND |
| Manufacturer Part#: |
ATS-08E-169-C3-R0 |
| Price: | $ 3.57 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08E-169-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.24576 |
| 30 +: | $ 3.15777 |
| 50 +: | $ 2.98229 |
| 100 +: | $ 2.80690 |
| 250 +: | $ 2.63146 |
| 500 +: | $ 2.54374 |
| 1000 +: | $ 2.28059 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks have been at the forefront of the industry for a very long time. The ATS-08E-169-C3-R0 is specifically designed for high performance cooling solutions and has become an increasingly popular option among customers and engineers. This article will explain the application field and working principle of the ATS-08E-169-C3-R0.
The ATS-08E-169-C3-R0 is a finned heat sink, and is made from a combination of aluminium and copper, making it both lightweight and durable. It is designed to provide effective heat transfer from a given component to its immediate environment. This is done by having a large number of conductive fins spread over the surface of the heat sink, creating a large area with which to dissipate heat away from the source. With the combination of its lightweight and effective dissipative properties, the ATS-08E-169-C3-R0 is a perfect choice for applications that require high-performance cooling solutions.
The ATS-08E-169-C3-R0 can be used in a wide range of applications, including power semiconductors, IC packages and power amplifier systems. It is particularly well suited to high-power operations, due to its ability to dissipate large amounts of heat and its durability. The ATS-08E-169-C3-R0 can also be used to cool devices which run at high temperatures, such as motor controllers and electronic control systems.
The working principle of the ATS-08E-169-C3-R0 is based on the laws of thermodynamics, in particular the principles of Convection, Conduction and Radiation. Firstly, the finned heat sink uses convection to allow cooler air to pass over the heat sink. This cooling air is then drawn away from the device, taking with it the heat generated by the device. Secondly, the heat sink uses conduction to absorb the heat from the device, drawing the heat away and transferring to the air around it. Finally, the heat sink uses radiation to dissipate the heat further away from the component.
In order to ensure the best possible performance from the ATS-08E-169-C3-R0, it is important to mount the heat sink correctly. The heat sink must be mounted to the device or the surrounding environment in order for it to work effectively. The heat sink must be placed so as to have a clear airflow between the device and the finned heat sink. It is also important to ensure that the fins are in direct contact with the device, as this ensures the most efficient heat transfer.
In conclusion, the ATS-08E-169-C3-R0 is a highly effective finned heat sink which is suited to a wide range of applications. Utilising the principles of Convection, Conduction and Radiation, the ATS-08E-169-C3-R0 is able to provide a highly efficient cooling solution. When correctly configured and mounted, the ATS-08E-169-C3-R0 can provide an effective solution for the cooling of high-power devices and systems.
The specific data is subject to PDF, and the above content is for reference