ATS-08E-18-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-08E-18-C3-R0-ND

Manufacturer Part#:

ATS-08E-18-C3-R0

Price: $ 4.33
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X15MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08E-18-C3-R0 datasheetATS-08E-18-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.89781
30 +: $ 3.68151
50 +: $ 3.46487
100 +: $ 3.24834
250 +: $ 3.03178
500 +: $ 2.81523
1000 +: $ 2.76109
Stock 1000Can Ship Immediately
$ 4.33
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.45°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are one of the most commonly used industrial components as they are used in many different applications that rely on efficient heat management. The ATS-08E-18-C3-R0 is one such thermal heat sink component that is designed to provide efficient and reliable thermal management.The ATS-08E-18-C3-R0 is a thermoelectric heat sink that is used to effectively dissipate heat from a hot surface. It consists of two aluminum fins that are connected to each other by an insulated copper plate. The fins are arranged in a staggered pattern to provide maximum surface contact and thus maximize heat transfer efficiency. The fins are also designed to provide optimal airflow to ensure maximum cooling performance.The heat sinks are commonly used in various applications. One of the most popular applications is in telecommunications, where the heat sinks are used to keep components such as transistors, amplifiers, and other active devices in their temperature bracket. This helps prevent damage to sensitive components and improve system stability and reliability.These heat sinks are also used in consumer electronics such as computers, laptops, and game consoles. The heat sinks are used to manage the heat generated by the components that are in use. This makes it possible for the components to operate at higher speeds, providing more performance and better user experience.The ATS-08E-18-C3-R0 is also used in automotive applications. Heat sinks can be found in exhaust systems and intake manifolds to help dissipate the heat generated by these components. This helps to reduce the amount of fuel consumed by the engine, as well as improve its overall efficiency.The ATS-08E-18-C3-R0 works by using the principle of thermoelectric cooling. This principle states that when two materials with different electrical properties are brought into contact with one another, heat is transferred from one material to the other. The thermoelectric cooling effect is generated by the flow of electrons between the two different materials. The heat sinks serve to dissipate the heat by allowing the electrons to flow from one material to the other.The heat sinks are designed to conform to the type of cooling system used in the application. The dimensions, arrangement, and thermal properties of the heat sink are all selected to optimize the heat transfer and dissipate the heat as efficiently as possible.The ATS-08E-18-C3-R0 is an effective thermal heat sink component that provides reliable thermal management for different applications. This makes it an ideal component for applications that require efficient thermal management. These heat sinks can be used in a variety of applications, including telecommunications, consumer electronics, and automotive applications.

The specific data is subject to PDF, and the above content is for reference

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