| Allicdata Part #: | ATS-08E-185-C3-R0-ND |
| Manufacturer Part#: |
ATS-08E-185-C3-R0 |
| Price: | $ 4.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X30MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08E-185-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.88647 |
| 30 +: | $ 3.67059 |
| 50 +: | $ 3.45467 |
| 100 +: | $ 3.23870 |
| 250 +: | $ 3.02279 |
| 500 +: | $ 2.80687 |
| 1000 +: | $ 2.75290 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a crucial component of any technological system. For this reason, proper temperature management of semiconductor devices must be achieved in order for them to operate reliably. Heat sinks are one of the most commonly used solutions for efficient thermal management, allowing large amounts of heat to be dissipated to prevent devices from overheating. The ATS-08E-185-C3-R0 is a thermal management device that is designed to dissipate heat in a safe and efficient manner.
The ATS-08E-185-C3-R0 is a thermal heat sink that is designed for applications such as high-power LEDs, radiators, air-conditioning systems, and other high-performance applications where thermal management is critical. It is constructed from extruded aluminum with a special fin pattern that increases surface area and therefore heat dissipation. The pin fin design provides high thermal communication between the large aluminum base and the surrounding air. This design provides superior heat dissipation performance when compared to other heat sinks designs.
The ATS-08E-185-C3-R0 also features a clip-on design that allows for easy installation and removal of the heat sink without the need for any special tools. This makes it ideal for use in environments where high temperatures are expected, such as electronics shops or manufacturing plants. The clip-on design also ensures that the heat sink will remain in place during operation, allowing for optimal performance.
In addition to its clip-on design, the ATS-08E-185-C3-R0 also features an advanced airflow design. This design takes advantage of the natural convection of air, directing it over the aluminum fins and quickly dissipating the heat. The natural airflow also increases the amount of air passing over the heat sink fins to further increase thermal communication and heat dissipation.
The ATS-08E-185-C3-R0 is designed to be used in environments where thermal management is critical. It is constructed from high-grade aluminum that is both durable and efficient at dissipating heat, and is designed to operate in temperatures up to 100°C. The clip-on design and natural airflow enable quick and easy installation or removal of the heat sink, while the special fin pattern ensures optimal thermal performance. The ATS-08E-185-C3-R0 is ideal for applications such as high-power LEDs, radiators, air-conditioning systems, and other high-performance applications where thermal management is critical.
The specific data is subject to PDF, and the above content is for reference