| Allicdata Part #: | ATS14627-ND |
| Manufacturer Part#: |
ATS-08E-188-C2-R0 |
| Price: | $ 4.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08E-188-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.18320 |
| 10 +: | $ 4.07169 |
| 25 +: | $ 3.84527 |
| 50 +: | $ 3.61910 |
| 100 +: | $ 3.39293 |
| 250 +: | $ 3.16673 |
| 500 +: | $ 2.94054 |
| 1000 +: | $ 2.88399 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.67°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are a type of cooling equipment that moves and dissipates heat from a particular device or component. This type of cooling is an integral part of many consumer and industrial electronics, as it allows for the efficient cooling of sensitive electronics. ATS-08E-188-C2-R0 is a thermal heat sink system designed to perform high-performance heat dissipation and spread heat over a large area.
This system is constructed of an aluminum housing and a copper-plated copper base thermal conductivity part. The aluminum housing improves the air convection coefficient and allows systems to dissipate heat as quickly as possible. The copper base of the ATS-08E-188-C2-R0 offers high thermal conductivity, providing efficient thermal control and dissipating heat evenly across a large area. This ensures uniform cooling of the device or component being cooled, making the ATS-08E-188-C2-R0 an ideal choice for a wide range of applications.
The thermal heat sink operates based on immersion cooling, which is a range of cooling processes that use liquid coolants like water, alcohol, or oil. The ATS-08E-188-C2-R0 is designed to fully submerge components into the coolant. This allows for efficient transfer of heat energy to a higher temperature level, resulting in improved cooling performance. The higher temperature of the coolant allows for more efficient dissipation of heat, resulting in improved cooling efficiency.
ATS-08E-188-C2-R0 is suitable for a wide range of applications in consumer, industrial, and medical electronics. The device can be used to cool computer parts, LED lighting systems, power supplies, and other power electronics. The thermal heat sink is also ideal for medical applications and laboratory settings which require precise temperature control.
The ATS-08E-188-C2-R0 is also designed with several features for increased protection and long-term performance. It is resistant to shock, vibrations, and thermal stress, and its surface treatment makes it resistant to corrosion. The aluminum housing also dissipates heat quickly and efficiently, making it ideal for demanding applications. Finally, the copper plate provides excellent thermal spread, improving the overall performance of the thermal heat sink.
Overall, the ATS-08E-188-C2-R0 is a high-performance thermal heat sink system designed for a wide range of applications. It is designed to ensure uniform cooling and to dissipate heat over a large area. The aluminum housing and copper base provide excellent thermal conductivity, resulting in improved cooling performance, and the device is resistant to shock, vibrations, and thermal stress. The ATS-08E-188-C2-R0 is a reliable and effective solution for cooling a wide variety of components in consumer, industrial, and medical electronics.
The specific data is subject to PDF, and the above content is for reference