ATS-08E-189-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-08E-189-C1-R0-ND

Manufacturer Part#:

ATS-08E-189-C1-R0

Price: $ 3.75
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X20MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08E-189-C1-R0 datasheetATS-08E-189-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.41208
30 +: $ 3.31968
50 +: $ 3.13526
100 +: $ 2.95079
250 +: $ 2.76641
500 +: $ 2.67419
1000 +: $ 2.39754
Stock 1000Can Ship Immediately
$ 3.75
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.72°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is essential in many applications, such as those involving sensitive electronic components or high-powered areas where heat generation must be controlled. Heat sinks are an essential form of thermal management, as they help to dissipate heat away from sensitive components. The ATS-08E-189-C1-R0 is a thermal heat sink that is designed to meet the demands of demanding applications. It is intended for applications where passive cooling is insufficient and active cooling is required. This heat sink is designed to be highly efficient, with its fin design optimizing heat dissipation.

The ATS-08E-189-C1-R0 is an aluminum heat sink with a fin design of fifty-two fins. The heat dissipation fins of this thermal heat sink are sixty-five millimeters in height and ninety millimeters in length. This heat sink is designed to reduce thermal resistance, allowing the heat generated by components to quickly be transferred to the heat sink for dissipation. The fin pattern of this heat sink is designed to reduce turbulence and increase air flow, allowing for maximum cooling efficiency.

In terms of application fields, the ATS-08E-189-C1-R0 thermal heat sink can be effectively used in areas with temperatures between -25°C to +85°C. It is an ideal choice for electronics projects or embedded systems that require high heat dissipation capabilities and hold up in extreme temperatures. Such applications include automotive electronics, power generating electronics, telecommunications, computers or any other application that require high-performance cooling solutions.

The ATS-08E-189-C1-R0 heat sink also has outstanding durability and reliability due to its aluminum construction. It is able to resist corrosion and is designed to last. The heat sink is also compliant with RoHS standards, meaning it is safe for the environment and of a high quality.

This thermal heat sink is easy to install due to its low-profile design and lightweight nature. It requires minimal effort to attach, and can be easily mounted to a board or chassis. This heat sink is also designed with multiple mounting options, allowing for installation in various applications.

In terms of its working principle, the ATS-08E-189-C1-R0 thermal heat sink efficient transfers heat generated by components to the heat sink, where it is dissipated away from the sensitive components. The highly efficient fin design and low-profile design allow for a large amount of air flow, further improving the rate of heat transfer and dissipation.

In conclusion, the ATS-08E-189-C1-R0 thermal heat sink is an ideal choice for applications that require cooling. Its efficient fin design and low-profile design allow for optimal cooling, making it ideal for applications with extreme temperatures. It is easy to install and requires minimal effort to attach, making it a great choice for designers and engineers looking for an efficient cooling solution.

The specific data is subject to PDF, and the above content is for reference

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