ATS-08E-23-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.06°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to the ATS-08E-23-C3-R0 Thermal - Heat Sink

The ATS-08E-23-C3-R0 Thermal - Heat Sink is a heat sink designed for cooling electronic components. It is designed to maintain a stable temperature in high-heat environments and allow for greater thermal efficiency. It is made of aluminum, anodized for durability, and is designed with a wide opening for maximum airflow and cooling potential. The heat sink also features an aspen core for increased heat dissipation, as well as a pin-socket joint for easy installation and removal.

Application Field of the ATS-08E-23-C3-R0 Thermal - Heat Sink

The ATS-08E-23-C3-R0 Thermal - Heat Sink is ideal for applications that require high thermal efficiency and maximum cooling potential. This heat sink can be used in a variety of devices, such as computer systems, audio systems, and home entertainment systems. It is also well suited for applications in medical imaging, industrial control systems, robotics, and integrated circuit chip-level cooling.

Working Principle of ATS-08E-23-C3-R0 Thermal - Heat Sink

The ATS-08E-23-C3-R0 Thermal - Heat Sink works to maintain a stable temperature in high-heat electronics components. The aluminum construction of the heat sink increases its ability to dissipate heat quickly. Its wide opening and aspen core allow for maximum cooling potential, while the pin-socket joint ensures easy installation and removal.The heat sink works by transferring heat away from the component and dissipating it into the air. The heat is first transferred from the component to the aluminum material of the heat sink. The aluminum then dissipates the heat into the air using a process of convection.

Advantages of ATS-08E-23-C3-R0 Thermal - Heat Sink

The ATS-08E-23-C3-R0 Thermal - Heat Sink offers numerous advantages to users. Its aluminum construction enhances thermal efficiency and cooling potential. The wide opening and aspen core promote maximum airflow. The pin-socket joint ensures easy installation and removal. Additionally, the anodized finish of the heat sink increases its durability and ensures a longer life span.

Conclusion

The ATS-08E-23-C3-R0 Thermal - Heat Sink is an ideal heat sink for a variety of applications. Its high thermal efficiency and quick heat dissipation make it a great asset in high-heat environments. The pin-socket joint, wide opening, and anodized finish add even more benefits and make the heat sink a must-have for cooling electronic components.

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