| Allicdata Part #: | ATS14655-ND |
| Manufacturer Part#: |
ATS-08E-24-C2-R0 |
| Price: | $ 5.97 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08E-24-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.37390 |
| 10 +: | $ 5.22837 |
| 25 +: | $ 4.93769 |
| 50 +: | $ 4.64726 |
| 100 +: | $ 4.35683 |
| 250 +: | $ 4.06637 |
| 500 +: | $ 3.77592 |
| 1000 +: | $ 3.70330 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks encompass a wide variety of mechanisms that allow heat to be transferred away from other objects. The pull out of this heat indirectly cools the item in question. High-performance central processing, radio-frequency, and graphics processing units (GPUs) all require heat sinks for temperature control, to ensure that no damage will occur to the products in question. An ATS-08E-24-C2-R0 heat sink is one such example of a heat transfer mechanism.
The ATS-08E-24-C2-R0 is a large form factor heat sink, preferred for applications that require a large surface area to provide the best thermal transfer. This includes formats and applications such as press-fit flash, Dynamic Random Access Memory (DRAM) and flip chip packages. The large form factor provides more contact area with the BGA or QFN package as well as more pins to increase heat transfer. The cavity-backed and deep fin design also helps to maximize cooling performance.
The working principle of ATS-08E-24-C2-R0 is that it makes use of the natural convection cooling process. Heat is absorbed from the hot source and conducted into thin fin walls of the high-performance thermal heat sink. The fin walls then dissipate the heat into the cold ambient air environment, cooling down the system in a natural way. It does this by creating a heat gradient that draws the heat away from the source and into the atmosphere. This is done by the combination of its large breathing surface area and highly efficient mechanical thermal structure. To further reduce the heat transfer, the surface of the fin waffle structure is minimized to create a very low-resistant air flow passage.
In conclusion, the ATS-08E-24-C2-R0 is an effective and efficient heat sink that makes use of natural convection cooling to effectively manage heat that is produced. This thermal heat sink is ideally suited for high-performance cpu applications and can be used in a variety of applications such as press-fit flash, Dynamic Random Access Memory (DRAM) and flip chip packages. Its fin walls create a low-resistance air flow passage, allowing for the heat to be dissipated quickly, efficiently and safely.
The specific data is subject to PDF, and the above content is for reference