| Allicdata Part #: | ATS-08E-24-C3-R0-ND |
| Manufacturer Part#: |
ATS-08E-24-C3-R0 |
| Price: | $ 5.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08E-24-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.85793 |
| 30 +: | $ 4.58808 |
| 50 +: | $ 4.31827 |
| 100 +: | $ 4.04838 |
| 250 +: | $ 3.77849 |
| 500 +: | $ 3.50860 |
| 1000 +: | $ 3.44112 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.43°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-08E-24-C3-R0 is a type of thermal management device, designed to dissipate the heat generated by electrical components and circuits. It is classified as a heat sink, a device used to transfer heat away from a component to a fluid medium, such as air or a liquid. Heat sinks are necessary for electrical components and circuits to function at optimal temperature ranges and are typically made up of a metallic material such as aluminum.
Application Field
The ATS-08E-24-C3-R0 is designed to manage heat generated by a variety of electronic components, such as LED (light-emitting diode) circuits, power modules, and digital logic. It is particularly effective for higher-power circuits and components that require heat to be dissipated quickly and efficiently. It can also be used in the automotive, telecommunications, networking, and aerospace industries.
Working Principle
The working principle of the ATS-08E-24-C3-R0 is relatively simple. It works by transferring the heat generated by the electronic component or circuit to a thermal material, such as aluminum or copper. The heat is then dissipated into the surrounding environment via conduction, convection, or radiation. In order to optimize the transfer of heat, the aluminum or copper heat sink must be designed with a minimal thermal resistance, allowing for the maximum transfer of heat away from the component. In addition, the heat sink will typically feature pins or fins that allow for maximum surface area for heat transfer. These pins or fins also help to increase air circulation, further helping to transfer heat away from the component.
Conclusion
The ATS-08E-24-C3-R0 is a thermal management device that is designed to dissipate the heat generated by a variety of electrical components and circuits. It is classified as a heat sink and features pins or fins that allow for maximum surface area for heat transfer. The device is ideal for higher-power circuits and components that require heat to be dissipated quickly and efficiently. It can also be used in the automotive, telecommunications, networking, and aerospace industries.
The specific data is subject to PDF, and the above content is for reference