| Allicdata Part #: | ATS14656-ND |
| Manufacturer Part#: |
ATS-08E-25-C2-R0 |
| Price: | $ 6.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08E-25-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.62590 |
| 10 +: | $ 5.47092 |
| 25 +: | $ 5.16726 |
| 50 +: | $ 4.86322 |
| 100 +: | $ 4.55925 |
| 250 +: | $ 4.25530 |
| 500 +: | $ 3.95135 |
| 1000 +: | $ 3.87536 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks is a material device, consisting of a conductive base and several fins or pins, designed to increase the surface area for heat transfer and dissipate thermal energy from a device or component heat source. An effective Heat Sink provides efficient cooling of electronic components, allowing them to operate at their maximum potential. The ATS-08E-25-C2-R0 Heat Sink is an effective cooling device that utilizes extruded aluminum construction and high air flow fan design.
The ATS-08E-25-C2-R0 Heat Sink is designed for versatility and cost effectiveness. It can be used for a variety of applications requiring low profile and high performance. It offers superior thermal solutions for applications that require low noise, low loss and high reliability. It is well-suited for industrial, medical, automotive and consumer electronics applications. Specifically, the ATS-08E-25-C2-R0 is ideal for microprocessor and other power electronics that require low profile cooling solutions.
The ATS-08E-25-C2-R0 utilizes an aerodynamic design for low air flow resistance and optimized thermodynamics. The design eliminates hot or cold spots that can be caused by air turbulence and increases the efficiency of air flow throughout the device. The Heat Sink features the latest technology in advanced heat transfer and radiant suppression. The low profile design allows the product to be fitted into any enclosure without sacrificing performance.
The ATS-08E-25-C2-R0 utilizes a variety of mechanisms to dissipate heat, including conduction, convection, and radiation. Heat is transferred away from critical components by conduction, through the metal fins of the Heat Sink. Heat is then dissipated through convection of air flow generated by the fan. Additionally, radiation is used to dissipate heat away from components in contact with the Heat Sink. By effectively utilizing these three mechanisms, the ATS-08E-25-C2-R0 is able to minimize temperature rise and maximize thermal performance.
The ATS-08E-25-C2-R0 is an effective and reliable thermal solution that provides superior cooling performance in a variety of applications. Its low profile and efficient heat transfer and dissipation makes it an ideal choice for applications where quiet operation and robust performance are required. The ATS-08E-25-C2-R0 is compatible with a wide range of device types and is easily installed into any available space. With its low profile design, the ATS-08E-25-C2-R0 is the perfect solution for any application that requires reliable and efficient cooling.
The specific data is subject to PDF, and the above content is for reference