| Allicdata Part #: | ATS-08E-32-C1-R0-ND |
| Manufacturer Part#: |
ATS-08E-32-C1-R0 |
| Price: | $ 5.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08E-32-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.71933 |
| 30 +: | $ 4.45704 |
| 50 +: | $ 4.19492 |
| 100 +: | $ 3.93271 |
| 250 +: | $ 3.67053 |
| 500 +: | $ 3.40835 |
| 1000 +: | $ 3.34281 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.45°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential in many applications due to heat generated by power devices and other parts of the device. Heat generated by the heat source can not be dissipated effectively and can drastically reduce the performance and life of the device. To meet the thermal management requirements, a good thermal management solution is necessary. Using a heat sink or heat spreader is one of the most common solutions. The ATS-08E-32-C1-R0 is a heat sink with a high performance and low thermal resistance to dissipate heat efficiently from sensitive components.
The ATS-08E-32-C1-R0 heat sink is made of aluminum, which has good thermal conductivity to effectively dissipate heat from power device. It consists of a heat sink base, fins and supporting frame. The heat sink base is a large area that provides a stable platform to support other parts. Fins are connected to the base by special manufacturing process and can extend the overall surface area for better heat dissipation. Supporting frames provide mechanical support and strength to the fins.
The design of ATS-08E-32-C1-R0 heat sink is very efficient in providing a high level of cooling performance. Due to its low profile design, the heat sink is ideal for applications with limited space. The heat sink has a wide range of applications, from industrial control systems to consumer electronics to power amplifiers. Its working principle is as follows:
Heat generated by the source is absorbed by the heat sink fins, then transferred into the cooler environment by the fins\' thermal conductivity. The fins also increase the surface area that provides efficient heat dissipation. Additionally, the heat is also effectively dissipated through the supportive frames that are connected to the heat sink fins, which helps to spread the heat evenly to the environment. Thus, the heat sink is capable of dissipating heat from the source much faster and more efficiently and provide better thermal management.
The ATS-08E-32-C1-R0 heat sink provides a reliable and efficient heat dissipation solution to meet the thermal management requirements of different applications. It is designed to be cost-effective and energy efficient, and its low-profile and compact design makes it suitable for applications where space is limited. It is also suitable for a wide variety of applications from consumer electronics to industrial control systems to power amplifiers. With its high performance and low thermal resistance, the ATS-08E-32-C1-R0 heat sink is an excellent choice for keeping your device running at optimal temperatures.
The specific data is subject to PDF, and the above content is for reference