ATS-08E-51-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-08E-51-C3-R0-ND

Manufacturer Part#:

ATS-08E-51-C3-R0

Price: $ 3.65
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X20MM L-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-08E-51-C3-R0 datasheetATS-08E-51-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.31695
30 +: $ 3.22707
50 +: $ 3.04781
100 +: $ 2.86858
250 +: $ 2.68930
500 +: $ 2.59965
1000 +: $ 2.33071
Stock 1000Can Ship Immediately
$ 3.65
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 14.22°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-heat sinks are an essential component in modern electronics. Providing consistent cooling to sensitive electronics and ensuring the reliability of their performance, thermal heat sinks are used for a variety of applications, including computers, medical and communications equipment, automotive and aerospace engineering, and a variety of industrial applications. The ATS-08E-51-C3-R0 is a popular heat sink device for many of these applications.

The ATS-08E-51-C3-R0 is an eight-module heat sink made of aluminum alloy. The device is designed to be both lightweight and durable, with a minimum operating temperature of -50 degrees Celsius and a maximum temperature of 150 degrees Celsius. The aluminum alloy provides superior thermal conductivity, which allows it to dissipate heat more efficiently than other materials. The device also features an integrated thermal grease pad, which helps to ensure good thermal contact between the heat sink and the components being cooled.

The ATS-08E-51-C3-R0 is most commonly used in applications that require a medium level of thermal protection. For example, the device can be used in automotive cooling applications such as spark ignition systems, brakes, transmissions, and electric motors. In addition, it can be used in computer cooling applications such as microprocessors, hard drives, and video cards. It can also be used for large industrial applications such as furnaces, fans, and industrial heaters.

The working principle of the ATS-08E-51-C3-R0 is simple. As the device is exposed to heat, the aluminum alloy in the heat sink begins to absorb the heat. This heat is then dissipated into the surrounding air, allowing the heat to be dissipated more quickly and efficiently. In addition, the integrated thermal grease pad helps to reduce the overall heat profile of the device, allowing more components to be cooled at the same time.

In addition to the cooling benefits of the ATS-08E-51-C3-R0, the device also provides other benefits. The cooling provided by the device can help to extend the life of sensitive electronics, as the heat can be dissipated quickly and efficiently, preventing components from overheating. In addition, the device can help to reduce noise coming from cooling fans, which makes it ideal for applications such as computers, medical equipment, and other electronic devices where noise levels must be kept to a minimum.

From automotive to industrial use, the ATS-08E-51-C3-R0 is an ideal thermal-heat sink for a variety of applications. The device offers superior cooling performance, a lightweight and durable construction, and an integrated thermal grease pad for optimal thermal conductivity. Furthermore, the device provides additional benefits such as extended component life and reduced noise, making it an ideal choice for a wide range of applications in numerous industries.

The specific data is subject to PDF, and the above content is for reference

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