| Allicdata Part #: | ATS-08F-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-08F-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-08F-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The ATS-08F-10-C1-R0 is a thermal heat sink that is designed to dissipate and manage heat generated from electronic components and equipment. Heat sinks are used to reduce the operating temperature of components and systems and prolong their life. The ATS-08F-10-C1-R0 is a heat sink designed to meet the demands of higher-end applications where heat dissipation and system performance are of paramount concern.
The Design Principle of ATS-08F-10-C1-R0
The general design principle of the ATS-08F-10-C1-R0 is to pump heat away from the source and expel it into the air. This is generally accomplished by using a series of horizontal fins attached to a central core, which are connected to the source. The fins increase the surface area of the core, allowing for more efficient heat transfer into the air. This heat is then dissipated by convection and radiation.
High-End Applications
The ATS-08F-10-C1-R0 is designed to be used in higher-end applications. This makes it well-suited for powering devices such as computers, routers, and servers that generate large amounts of heat. Even in the most demanding applications, the ATS-08F-10-C1-R0 is capable of dissipating and managing heat efficiently. As a result, components and systems can run at optimal temperatures with minimal energy consumption, allowing users to enjoy peak performance with minimal energy costs.
Usability and Adaptability
The ATS-08F-10-C1-R0 is also designed for optimal usability and adaptability. It is designed to be easy to install and configure in a variety of settings, allowing for maximum flexibility in its use. Furthermore, the fins also have mounting holes for convenient attachment to any compatible device. Finally, the heat sink is designed to be completely compatible with any standard CPU slot, including AM2, AM3, FM1, FM2, LGA775, LGA1150, LGA1155, LGA1156, and LGA1366. This ensures that users can use the ATS-08F-10-C1-R0 in virtually any setting.
Durability
The ATS-08F-10-C1-R0 is also designed for long-term durability. This makes it an ideal choice for long-term projects that require reliable and consistent performance. The heat sink itself is made from aluminum and is designed to be corrosion resistant, ensuring long-term durability, even when exposed to humidity and moisture. Furthermore, the fins are constructed from galvanized steel, offering superior heat dissipation and durability.
Conclusion
In conclusion, the ATS-08F-10-C1-R0 is a thermal heat sink designed for high-end applications where heat dissipation and system performance are of paramount concern. It is designed with usability and adaptability in mind, ensuring maximum compatibility with any standard CPU slot. It is also constructed from durable materials for long-term reliability. All of these features make the ATS-08F-10-C1-R0 an ideal choice for any application requiring reliable and long-term thermal heat management.
The specific data is subject to PDF, and the above content is for reference